1 Packaging Overview

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PolarFire SoC FPGAs are available in multiple packages. Each package (device variant) has various I/O banks with the flexibility of using different I/O standards. HSIO and GPIO banks have a maximum supply voltage of 1.8V and 3.3V, respectively.

The following table lists the PolarFire SoC FPGA variants, with user I/O and XCVR lanes, in Pb-free packages.

Table 1-1. Organization of I/O Banks
Bank Number	FCG1152	FCG1152	FCVG784	FCVG784	FCVG484	FCSG536	FCSG325
Bank Number	MPFS460T	MFPS250T	MPFS250T/MPFS160T	MPFS095T	MPFS250T/MPFS160T/MPFS095T/MPFS025T	MPFS250T/MPFS160T/MPFS095T	MPFS095T/MPFS025T
Bank 0	HSIO	HSIO	HSIO	HSIO	HSIO	HSIO	HSIO
Bank 1	GPIO	GPIO	GPIO	GPIO	GPIO	GPIO	GPIO
Bank 2	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO
Bank 3	JTAG/FIXED I/O	JTAG/FIXED I/O	JTAG/FIXED I/O	JTAG/FIXED I/O	JTAG/FIXED I/O	JTAG/FIXED I/O	JTAG/FIXED I/O
Bank 4	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO	MSSIO
Bank 5	MSS-SGMII	MSS-SGMII	MSS-SGMII	MSS-SGMII	MSS-SGMII	MSS-SGMII	MSS-SGMII
Bank 6	MSS-DDR	MSS-DDR	MSS-DDR	MSS-DDR	MSS-DDR	MSS-DDR	MSS-DDR
Bank 7	GPIO	GPIO	GPIO	—	—	GPIO	—
Bank 8	HSIO	HSIO	HSIO	HSIO	—	—	—
Bank 9	GPIO	GPIO	GPIO	GPIO	—	—	—
XCVR 0	Yes	Yes	Yes	Yes	Yes	Yes	Yes
XCVR 1	Yes	Yes	Yes	No	No	No	No
XCVR 2	Yes	Yes	No	No	No	No	No
XCVR 3	Yes	Yes	No	No	No	No	No
XCVR 4	Yes	No	No	No	No	No	No

Note: 12 I/Os from Bank 9 are connected to Bank 1 power in the package substrate to maintain pin-migration among devices and to maximize pin count in this package.