2 Package Material Information

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The following table lists the PolarFire SoC ball grid array RoHS packages.

Table 2-1. PolarFire SoC Ball Grid Array RoHS Packages
Package Balls	FCG1152	FCVG784	FCVG484	FCSG536	FCSG325
Package Pitch	1 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm
Substrate Material	Epoxy Glass	Epoxy Glass	Epoxy Glass	BT Resin	BT Resin
Solder Ball Composition RoHS	SAC305	SAC305	SAC305	SAC305	SAC305
Solder Bump Material	Sn98.2/Ag1.8	Sn98.2/Ag1.8	Sn98.2/Ag1.8	Cu Pillar + Solder Cap	Cu Pillar + Solder Cap

Important:

For all flip-chip BGA packages—Only FCSG325 and FCSG536 are not vented. FCG1152, FCVG784, and FCVG484 are vented.
Solder Cap's composition is 98.2% Sn, 1.8% Ag.

The following table lists the PolarFire SoC ball grid array leaded packages.

Table 2-2. PolarFire SoC Mil Temp Packages
Package Balls	FC1152M	FCV784M	FCV484M	FCS536M	FCS325M
Package Pitch	1 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm
Substrate Material	Epoxy Glass	Epoxy Glass	Epoxy Glass	BT Resin	BT Resin
Solder Ball Composition RoHS	Sn63:Pn37	Sn63:Pn37	Sn63:Pn37	Sn63:Pn37	Sn63:Pn37
Solder Bump Material	Sn98.2/Ag1.8	Sn98.2/Ag1.8	Sn98.2/Ag1.8	Cu Pillar + Solder Cap	Cu Pillar + Solder Cap

Important: Solder Cap's composition is Sn98.2/Ag1.8.

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