7 Recommended PCB Design Rules for BGA Packages

Microchip provides the diameter of a land pad on the package side. This information is required before starting the board layout so the board pads can be designed to match the component-side land geometry. The typical values of these land pads are shown in the following figure and summarized in Table 7-1. For Microchip BGA packages, Non-Solder Mask Defined (NSMD) pads on the board are suggested to allow a clearance between the land metal (diameter) and the solder mask opening (diameter) as shown in the following figure.

The space between the NSMD pad and the solder mask, the actual signal trace widths, and via dimensions depend on the capability of the PCB vendor. The cost of the PCB is higher when the line width and spaces are smaller.

Figure 7-1. Ball and Via Dimensions
Table 7-1. Suggested PCB Land Pattern
Design Rule for PackagesFCG PackagesFCVG PackagesFCSG Packages
BGA ball pitch1.0 mm0.8 mm0.5 mm
PCB ball pad diameter0.5 mm0.4 mm0.275 mm
PCB ball pad solder mask opening0.6 mm0.5 mm0.35 mm
Note: For more information about package fanout, see PolarFire SoC FPGA Package Fanout Application Note (yet to be published).