4 Thermal Management

Microchip PolarFire SoC FPGAs are offered in lidded flip-chip BGA (FCBGA) format. Lidded FCBGA features a controlled bond-line thermal interface material (TIM) thickness that reduces the thermal resistance (Theta-JC) between the junction and the externally applied thermal solution. The lid or heat spreader also spreads the heat away from the die to the package perimeter and to the printed circuit board.

Optimized package electrical performance with multiple power and ground planes to take care of signal return paths, and dense core via under the die to improve power delivery adds benefit in dissipating heat through the bottom of the package and to the board.

PolarFire SoC FPGAs in FCVG484 are also available in bare-die FCBGA. Bare-die flip-chip BGA produces the lowest possible thermal resistance (Theta-JC) between the junction and any externally applied thermal solution.