50.9 Thermal Characteristics

Table 50-6. Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	48.3	°C/W	28-pin SPDIP package
			45.2	°C/W	28-pin SOIC package
			53.7	°C/W	28-pin SSOP package
			36.3	°C/W	28-pin VQFN package
			40.0	°C/W	40-pin PDIP package
			29.9	°C/W	40-pin QFN package
			57.5	°C/W	44-pin TQFP package
			50.7	°C/W	48-pin TQFP package
			25.9	°C/W	48-pin VQFN package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
Note: See Absolute Maximum Ratings for total power dissipation.

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