2.7.1 Cleaning

The exposed GND pad helps to self-align the RNWF11 Module, avoiding pad misalignment. The recommendation is to use no-clean solder pastes. Ensure that the reflow process fully dries the no-clean paste fluxes. This can require longer reflow profiles and/or peak temperatures toward the high end of the process window as per the recommendation of the solder paste vendor. The uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the field.