2.7 RNWF11 Module Reflow Profile Information

The assembly of the RNWF11 Module utilized the IPC/JEDEC J-STD-020 Standard lead-free reflow profile. The user can solder the RNWF11 Module to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the RNWF11 Module, adhere to the following recommendations:

• For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation (DS00000233).
• Do not exceed a Peak Temperature (TP) of 250°C.
• For more details on specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.
• Use no-clean flux solder paste.
• Do not wash as moisture can be trapped under the shield.
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.