5.3.5.8 Unbond Device or Unbond
| Firmware Version 1.0 | Firmware Version 1.2 and Later |
|---|---|
|
|
Note: All firmware version 1.0 syntax remains valid in version 1.2 and later. | |
Command U or UB removes existing bonding. This command works in both central or peripheral GAP roles.
Command U or UB expects one input parameter. The parameter indicates the index of the bonding that needs to be removed. Use command LB to determine the index of the bonding. If the input parameter is the letter Z, then all bonding information is cleared. If an empty index is available, the new pairing and bonding information is added at the first available empty index.
| Item | Firmware Version 1.0 and Later | Description |
|---|---|---|
| Example: | U,1 | Remove the bond with index 1 |
| Response: | AOK | Success |
Err | Syntax error or invalid parameter |
| Item | Firmware Version 1.2 and Later | Description |
|---|---|---|
| Example: | UB,1 | Remove the bond with index 1 |
| Response: | AOK | Success |
Err | Syntax error or invalid parameter |