1.1.1 PolarFire Decoupling Capacitors

The following tables list the requirement of all decoupling capacitors for different device variants and packages.

Table 1-2. Power-Supply Decoupling Capacitors¹—MPF500T - FCG1152/FCG784 (1 mm)
Pin Name	Ceramic							Tantalum
Pin Name	4.7 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	4	—	—	—	—	3
VDD18	—	—	2	—	—	—	2	—
VDD25	—	—	5	—	—	1	—	—
VDDA	3	1	6	—	—	—	2	—
VDDA25	—	—	4	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	2	—	—	—	—	—

Table 1-3. Power-Supply Decoupling Capacitors¹—MPF300T - FCG1152/FCG784/FCG484 (1 mm)
Pin Name	Ceramic							Tantalum
	4.7 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	4	—	—	—	—	2
VDD18	—	—	2	—	—	—	2	—
VDD25	—	—	5	—	—	1	—	—
VDDA	3	1	6	—	—	—	1	—
VDDA25	—	—	4	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	2	—	—	—	—	—

Table 1-4. Power-Supply Decoupling Capacitors¹—MPF300T/MPF200T/MPF100T/MPF050T - FCVG484 (0.8 mm)
Pin Name	Ceramic								Tantalum
	1 nF	2.2 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	—	4	1	—	—	—	2
VDD18	—	—	—	2	—	—	—	2	—
VDD25	—	—	—	5	—	—	1	—	—
VDDA	—	2	2	1	—	—	—	1	—
VDDA25	1	—	—	1	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	—	2	—	—	—	—	—

Table 1-5. Power-Supply Decoupling Capacitors¹—MPF300T/MPF200T - FCSG536 (0.5 mm)
Pin Name	Ceramic								Tantalum
	1 nF	2.2 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	—	4	1	—	—	—	2
VDD18	—	—	—	2	—	—	—	2	—
VDD25	—	—	—	5	—	—	1	—	—
VDDA	2	3	1	1	—	—	—	1	—
VDDA25	1	—	—	1	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	—	2	—	—	—	—	—

Table 1-6. Power-Supply Decoupling Capacitors¹—MPF200T - FCG784/FCG484 (1 mm)
Pin Name	Ceramic							Tantalum
	4.7 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	2	2	—	—	—	—	2
VDD18	—	—	2	—	—	—	2	—
VDD25	—	—	5	—	—	1	—	—
VDDA	3	1	6	—	—	—	1	—
VDDA25	—	—	4	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	2	—	—	—	—	—

Table 1-7. Power-Supply Decoupling Capacitors¹—MPF200T/MPF100T/MPF050T- FCSG325 (0.5 mm)
Pin Name	Ceramic									Tantalum
	1 nF	2.2 nF	4.7 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	—	—	4	1	—	—	—	2
VDD18	—	—	—	—	2	—	—	—	2	—
VDD25	—	—	—	—	5	—	—	1	—	—
VDDA	—	1	1	1	1	—	—	—	1	—
VDDA25	1	—	—	—	1	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	—	—	2	—	—	—	—	—

Table 1-8. Power-Supply Decoupling Capacitors¹—MPF100T - FCG484 (1 mm)
Pin Name	Ceramic									Tantalum
	1 nF	2.2 nF	4.7 nF	10 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	330 µF
VDD	—	—	—	2	2	1	—	—	—	1
VDD18	—	—	—	—	2	—	—	—	2	—
VDD25	—	—	—	—	5	—	—	1	—	—
VDDA	—	—	3	1	6	—	—	—	1	—
VDDA25	1	—	—	—	4	—	—	—	1	—
VDDIO3	—	—	—	—	—	—	—	—	—	—
VDDAUXx²	—	—	—	—	2	—	—	—	1	—
GPIO Bank³	—	—	—	—	2	—	—	—	1	—
HSIO Bank⁴	—	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	2	—	—	1	—	—
XCVR_VREF	—	—	—	—	2	—	—	—	—	—

Decoupling capacitors other than those listed in the previous tables can be used if the physical sizes of capacitors meet or exceed the performance of the network given in this example. Substitution would require analyzing the resulting power distribution system's impedance versus frequency to ensure that no resonant impedance spikes the result. See Figure 1-1 for power supply design.

For more information about the internal package capacitance for power supplies associated with PolarFire packages, see section 2.4.2.1 section of PolarFire FPGA Packaging and Pin Descriptions User Guide.

The following table lists the required decoupling capacitors for PolarFire packages.

Table 1-9. Recommended Decoupling Capacitors For PolarFire Devices
De-Cap Value	Part Number	Package	Description
0.1 µF	GRM155R71C104KA88D	0402	For 1 mm package
10 nF	GRM15XR11C103KA86	0402	For 1 mm package
4.7 nF	GRM155R11H472KA01	0402	For 1 mm package
10 µF	GRM21BR71A106KE51	0805	Bulk Caps (for 0.5, 0.8, and 1 mm)
47 µF	GRM31CR61A476KE15	1206	Bulk Caps (for 0.5, 0.8, and 1 mm)
330 µF	T495D337K010ATE150	2917	Bulk Caps (for 0.5, 0.8, and 1 mm)
1 nF	GRM033R71C102KA01	0201	For 0.8/0.5 mm package
2.2 nF	GRM033R71A103KA01	0201	For 0.8/0.5 mm package
10 nF	GRM033R71A103KA01	0201	For 0.8/0.5 mm package
0.1 µF	GRM033C71C104KE14	0201	For 0.8/0.5 mm package

Note:

The guidelines are provided on how to effectively decouple only the FPGA device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the FPGA. Follow the recommended operational conditions as per PolarFire FPGA Datasheet .
Required Decoupling Capacitor for each VDDAUXx.
Required Decoupling Capacitor for each GPIO bank.
Required Decoupling Capacitor for each HSIO bank.

Important: The user can use equivalent capacitor values from a different vendor. For more information about Packaging Decoupling Capacitors, see PolarFire FPGA Packaging and Pin Descriptions User Guide.