11.1.3 Aperture Design for Thermal Pad

  • Small multiple openings are used instead of one big opening, as shown in the following figure
    Figure 11-1. IS20xxS SoC Reflow Profile Aperture Design
  • 60 to 80% solder paste coverage
  • Rounded corners to minimize clogging
  • Positive taper walls (5° tapering) with the bottom opening is larger than the top opening, as shown in the following figure
    Figure 11-2. IS20xxS SoC Stencil Type