4.10 Bluetooth Low Energy RF Characteristics

Table 4-12. Bluetooth Low Energy RF Characteristics
AC CharacteristicsStandard Operating Conditions: VDDIO = VDDANA 1.9-3.6V (unless otherwise stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Temp

Param. No.SymbolCharacteristicsMin.Typ(1)Max.UnitsConditions
BTG1FREQFrequency range of operation24022480MHz
BTTX1TXPWR:MPABluetooth® transmit power MPA11.5dBm
BTTX2TXPWR:LPABluetooth transmit power LPA4.0dBm
BTX3TXIB:1MBPSIn-band emission for FTX ± 2 MHz-32dBm
In-band emission for FTX ± (3+N) MHz-45dBm
BTX4TXIB:2MBPSIn-band emission for FTX ± 4 MHz-43dBm
In-band emission for FTX ± 5 MHz-48dBm
In-band emission for FTX ± (6+N) MHz-51dBm
BTRX1RXSENSEReceiver sensitivity at 1 Mbps-95.5dBm(4)
Receiver sensitivity at 2 Mbps-92.5dBm(4)
Receiver sensitivity at 500 kbps-98.5dBm(4)
Receiver sensitivity at 125 kbps-102dBm(4)
BTRX2MAXINSIGMaximum input signal level at 1 Mbps0dBm
Maximum input signal level at 2 Mbps0dBm
Maximum input signal level at 500 kbps0dBm
Maximum input signal level at 125 kbps0dBm
BTRX3CI1M:COCHC/I Co channel rejection13dB
CI1M: ± -1 MHzC/I adjacent channel rejection14dB
CI1M: ± -2 MHzC/I adjacent channel rejection13dB
CI1M:ADJ(3+n)C/I alternate channel rejection21dB
CI1M:IMGC/I image frequency rejection15dB
CI1M:IMG ± -1 MHzC/I adjacent channel to image freq rejection16dB
BTRX4CIS2:COCHC/I Co channel rejection11dB
CIS2: ± -1 MHzC/I adjacent channel rejection17dB
CIS2: ± -2 MHzC/I adjacent channel rejection17dB
CIS2:ADJ(3+n)C/I alternate channel rejection19dB
CIS2:IMGC/I image frequency rejection14dB
CIS2:IMG ± -1 MHzC/I adjacent channel to image freq rejection18dB
BTRX5CIS8:COCHC/I Co channel rejection5dB
CIS8: ± -1 MHzC/I adjacent channel rejection13dB
CIS8: ± -2 MHzC/I adjacent channel rejection12dB
CIS8:ADJ(3+n)C/I alternate channel rejection12dB
CIS8:IMGC/I image frequency rejection9dB
CIS2:IMG ± -1 MHzC/I adjacent channel to image freq rejection17dB
BTRX6CI2M:COCHC/I Co channel rejection13dB
CI2M: ± -2 MHzC/I adjacent channel rejection17dB
CI2M: ± -4 MHzC/I adjacent channel rejection19dB
CI2M:ADJ(6+2n)C/I alternate channel rejection19dB
CI2M:IMGC/I image frequency rejection16dB
CI2M:IMG ± -2 MHzC/I adjacent channel to image freq rejection18dB
BTRX7BLOCK1M:<2 GHZBlocking performance from 30-2 GHz20dB
BLOCK1M:2 GHZ<SIG<2399 MHzBlocking performance from 2003-2399 MHz14dB
BLOCK1M:2484 MHZ<SIG<2977 MHzBlocking performance between 2484-2997 MHz20dB
BLOCK1M:3 GHZ<SIG<12.75 GHzBlocking performance between 3-12.5 GHz20dB
BTRX8BLE1M:INTERMODInter modulation performance for BLEM14.5dB
BLE2M:INTERMODInter modulation performance for BLEM21.5dB
Note:
  1. Measured at 25℃, averaged across all voltages and channels
  2. Measured on a board with the reference schematic
  3. PDU length = 37, channels = 2402/2426/2440/2480 MHz
Table 4-13. Bluetooth Low Energy RF Current Characteristics
AC CharacteristicsStandard Operating Conditions: VDDIO = VDDANA 1.9-3.6V (unless otherwise stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Temp

Param. No.SymbolCharacteristicsRF PowerCPU FrequencyMin.Typ.Max.UnitsConditions
IBLETX1IDDTXMPACurrent consumption with output power in DC-DC mode 1 Mbps+12 dBm64 MHz42.8mA
IBLETX4Current consumption at +12 dBm output power in MLDO mode+12 dBm64 MHz96.7mA
IBLETX7IDDTXLPACurrent consumption at +4 dBm output power in DC-DC mode 1 Mbps4 dBm64 MHz24.9mA
IBLETX10Current consumption at +4 dBm output power in MLDO mode4 dBm64 MHz55.5mA
IBLETX7IDDTXLPA0Current consumption at +0 dBm output power in DC-DC mode 1 Mbps0 dBm64 MHz22.7mA
IBLETX10Current consumption at 0 dBm output power in MLDO mode0 dBm64 MHz47.6mA
IBLERX1IDDRXBLE1MCurrent consumption at RX signal level -80 dBm in DC-DC mode -80 dBm64 MHz20.6mA
IBLERX4Current consumption at RX signal level -80 dBm in MLDO mode -80 dBm64 MHz40.6mA
Note:
  • Current consumption is measured on a board based upon the Microchip Technology Reference Design.
  • Current consumption is for the entire SoC (including the MCU), measured at the input power rail.
  • Current consumption is measured using HUT code.
  • Current reported is the average of the current during the transmit or receive burst (exclude off cycle of the transmit/receive operation).
Figure 4-7. Module Bluetooth Low Energy Receive Sensitivity vs Temperature
Note:
  • Bluetooth Low Energy receive sensitivity is measured across temperatures at 3.6V, 2440 MHz, uncoded data at 1 Ms/s.
  • PDU length = 37
  • Sensitivity is measured according to the SIG specifications.
Figure 4-8. Module Bluetooth Low Energy Receive Sensitivity vs Frequency
Note:
  • Bluetooth Low Energy sensitivity is measured across channels at 3.6V at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37
  • Sensitivity is measured according to the SIG specifications
Figure 4-9. Bluetooth Low Energy 1M CI Margin
Note:
  • Bluetooth Low Energy 1M C/I Margin is measured at 2440 MHz at 25℃, 3.6V, uncoded data at 1 Ms/s.
  • C/I test is done with HUT code based on the SIG specifications.
  • Reported C/I margin is the margin above the C/I specifications from SIG.
Figure 4-10. Bluetooth Low Energy Receive Sensitivity vs Voltage
Note:
  • Bluetooth Low Energy receive sensitivity is measured at 2440 MHz at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37
  • Sensitivity is measured according to the SIG specifications.
Figure 4-11. Bluetooth Low Energy Receive Sensitivity vs Temperature
Note:
  • Bluetooth Low Energy receive sensitivity is measured across channels at 3.6V, 2440 MHz, uncoded data at 1 Ms/s.
  • PDU length = 37
  • Sensitivity is measured according to the SIG specifications.
Figure 4-12. Bluetooth Low Energy Receive Sensitivity vs Frequency
Note:
  • Bluetooth Low Energy receiver sensitivity is measured across channels at 3.6V at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37
  • Sensitivity is measured according to the SIG specifications.
Figure 4-13. Bluetooth Low Energy Receive Current vs Temperature
Note:
  • Bluetooth Low Energy receive current is measured at 3.3V (Buck mode), uncoded data at 1 Ms/s with LNA configured at maximum gain.
  • PDU length = 37
  • Current is measured on input power rail to SoC (includes processor current as well).
  • Current is measured with HUT code.
Figure 4-14. Bluetooth Low Energy Transmit Power vs Frequency
Note:
  • Bluetooth Low Energy transmit power is measured across frequency after transmit power calibration at 3.3V (Buck mode).
  • Transmit power is measured with HUT code.
  • Transmit power is measured after the PA matching and LPF.
Figure 4-15. Bluetooth Low Energy Transmit Power vs Transmit Power Level
Note:
  • Bluetooth Low Energy transmit power is measured at 2440 MHz after transmit power calibration.
  • Transmit power is measured on board based on Microchip Technology Reference Design.

  • Transmit power is measured after PA match and LPF.

  • Transmit power is measured with HUT code.
  • Transmit power is controlled by transmit power settings on HUT code for measurement.
Figure 4-16. Bluetooth Low Energy Transmit Power vs VDD Supply Voltage
Note:
  • Bluetooth Low Energy transmit power is measured across voltage after transmit power calibration.
  • Transmit power is measured after calibration at +12 dBm (± 0.5 dBm).

  • Transmit power is measured on-board based on the Microchip Reference Design.

  • Transmit power is measured after the LPA and PA match section.

  • Transmit power is measured with HUT code.
Figure 4-17. Bluetooth Low Energy Transmit Power vs. Temperature
Note:
  • Bluetooth Low Energy transmit power is measured across temperature after transmit power calibration at 3.6V and 2440 MHz.
  • Transmit power is measured with HUT code.
  • Temperature power compensation is triggered before power measurement.
  • Transmit power is measured after the PA matching and LPF.
Figure 4-18. Bluetooth Low Energy Transmit Current vs Temperature
Note:
  • Bluetooth Low Energy transmit current is measured at 3.3V (Buck mode) at 2440 MHz across temperature.
  • Transmit current is measured after calibration at +12 dBm (± 0.5 dBm).
  • Current is measured on input power rail to SoC.
  • Current is measured with HUT code.