4.1 Absolute Maximum Electrical Characteristics

Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Table 4-1. Absolute Maximum Ratings
ParameterValue
Ambient temperature under bias-40°C to +85°C
Storage temperature-65°C to +150°C
Voltage on VDD / VDDIO with respect to GND-0.3V to +4.0V
Voltage on pins, with respect to GND-0.3V to (VDD + 0.3V)
Maximum current out of GND pins300 mA
Maximum current into VDD pins(2)300 mA
Maximum output current sourced/sunk by any Low Current Mode I/O pin (4x drive strength)10 mA
Maximum output current sourced/sunk by any High Current Mode I/O pin (8x drive strength)15 mA
Maximum current sink by all ports120 mA
Maximum current sourced by all ports(2)120 mA
ESD Qualification
Human Body Model (HBM) per JESD22-A1142000V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)…(All pins/Corner pins)+500V/-500V
Note:
  1. Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to the maximum rating conditions for extended periods may affect device reliability.
  2. Maximum allowable current is a function of device maximum power dissipation (See the Thermal Operating Conditions table in the Thermal Specifications from Related Links).