A Appendix: Supported Memory Configurations

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This section provides details on the available configurations for the different memory types supported in PolarFire devices.

DDR4

The PolarFire DDR Subsystem supports non-3DS DDR4 devices.

DDR4 SDRAM is available in Dual In-Line Memory Modules (DIMM), Small Outline DIMMs (SO-DIMM), and as discrete devices. For information about the number of rows, columns, and bank bits required for DIMM or SO-DIMM configuration, refer to the data sheet associated with the DIMM module connected to the PolarFire device.

The following table lists the number of row bits, column bits, bank bits, and chip selects required for standard discrete DDR4 SDRAM devices in non-3DS configurations.

Table A-1. Non-3DS DDR4 SDRAM Device Configurations
Stack/Chip Size	Configuration	Row Bits	Column Bits	Bank Group Bits	Bank Bits
2	128M × 16	14	10	1	2
2	64M × 32	13	10	1	2

DDR3 and LPDDR3

The following table lists the number of row bits, column bits, and bank bits required for standard discrete DDR3, LPDDR3, and SDRAM devices.

Table A-2. Standard DDR3, LPDDR3, and SDRAM Device Configurations
Memory Type	Chip Size	Configuration	Row Bits	Column Bits	Bank Bits
DDR3	512 Mb	32M × 16	12	10	3
	1024 Mb	64M × 16	13	10	3
	2048 Mb	128M × 16	14	10	3
	4096 Mb	256M × 16	15	10	3
	8192 Mb	512M × 16	16	10	3
LPDDR3	4 Gb	128M × 32	14	10	3
	6 Gb	192M × 32	15	10	3
	8 Gb	128M × 32	15	10	3
	12 Gb	384M × 32	15	11	3
	16 Gb	512M × 32	15	11	3