38 High-Temperature Electrical Characteristics

This section provides electrical characteristics for operating in an ambient temperature range of -40°C to +150°C. The specifications between -40°C to +150°C are identical to those shown in Electrical Characteristics for operation between -40°C to +125°C, with the exception of the parameters listed in this section. Parameters in this section begin with an H, which denotes High temperature. For example, Parameter HDC21 is equivalent to Parameter DC21 in the Electrical Characteristics chapter.

Absolute maximum ratings for the dsPIC33AK128MC106 family devices are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device, at these or any other conditions above the parameters indicated in the operation listings of this specification, is not implied.

Table 38-1. Absolute Maximum Ratings(1)
Ambient temperature under bias-40°C to +150°C
Storage temperature-65°C to +150°C
Voltage on VDD with respect to VSS-0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(3)-0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD ≥ 3.0V(3)-0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(3)-0.3V to +3.6V
Maximum current out of VSS pin200 mA
Maximum current into VDD pin(2)200 mA
Maximum current sunk/sourced by any 4x I/O pin15 mA
Maximum current sunk/sourced by any 8x I/O pin25 mA
Maximum current sunk by a group of I/Os between two VSS pins(4)80 mA
Maximum current sourced by a group of I/Os between two VDD pins(4)80 mA
Maximum current sunk by all I/Os(2)200 mA
Maximum current sourced by all I/Os(2)200 mA
Note:
  1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those, or any other conditions above those indicated in the operation listings of this specification, is not implied.
  2. Maximum allowable current is a function of device maximum power dissipation (see DC Characteristics).
  3. See the Pin Diagrams section for the 5V tolerant pins.
  4. Not applicable to AVDD and AVSS pins.
Table 38-2. Operating MHz vs. Voltage
CharacteristicVDD Range
 (in Volts)Temperature Range
 (in °C)Maximum MHz dsPIC33AK128MC106 Family
—3.0V to 3.6V-40°C to +150°C200
Table 38-3. Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit

High Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

TJ

TA

-40

-40

—

—

+165

+150

°C

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD – Σ IOH)

PDPINT + PI/Ow

I/O Pin Power Dissipation:

I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 38-4. Operating Current (IDD)
DC CharacteristicsOperating CurrentStandard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature


Parameter No.Typ.(1)Max.UnitsConditions
Operating Current (IDD)(2)
HDC214599mA150°C3.3V

20 MHz (N = 1, N2 = 7,

N3 = 4, M = 70,

FVCO = 560 MHz,

FPLLO = 20 MHz)

HDC2248102mA150°C3.3V

50 MHz (N = 1, N2 = 4,

N3 = 3, M = 75,

FVCO = 600 MHz,

FPLLO = 50 MHz)

HDC2352107mA150°C3.3V

100 MHz (N = 1, N2 = 3,

N3 = 2, M = 75,

FVCO = 600 MHz,

FPLLO = 100 MHz)

HDC2457112mA150°C3.3V

150 MHz (N = 1, N2 = 2,

N3 = 2, M = 75,

FVCO = 600 MHz,

FPLLO = 150 MHz)

HDC2562116mA150°C3.3V

200 MHz (N = 1, N2 = 3,

N3 = 1, M = 75,

FVCO = 600 MHz,

FPLLO = 200 MHz)

Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.

    Base Run current (IDD) is measured as follows:

    • Oscillator is switched to EC+PLL mode in software
    • OSC1 pin is driven with external 8 MHz square wave with levels from 0.3V to VDD – 0.3V
    • OSC2 is configured as an I/O
    • Watchdog Timer is disabled
    • All I/O pins (except OSC1) are configured as outputs and driving low
    • No peripheral modules are operating or being clocked (defined PMDx bits are all ‘1’s)
    • JTAG is disabled
    • NOP instructions are executed in while(1) loop
Table 38-5. Idle Current (IIDLE)(2)
DC CharacteristicsIdleStandard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Parameter No.Typ.(1)Max.UnitsConditions
HDC414397mA150°C3.3V

20 MHz (N = 1, N2 = 7,

N3 = 4, M = 70,

FVCO = 560 MHz,

FPLLO = 20 MHz)

HDC4245102mA150°C3.3V

50 MHz (N = 1, N2 = 4,

N3 = 3, M = 75,

FVCO = 600 MHz,

FPLLO = 50 MHz)

HDC4347104mA150°C3.3V

100 MHz (N = 1, N2 = 3,

N3 = 2, M = 75,

FVCO = 600 MHz,

FPLLO = 100 MHz)

HDC4449107mA150°C3.3V

150 MHz (N = 1, N2 = 2,

N3 = 2, M = 75,

FVCO = 600 MHz,

FPLLO = 150 MHz)

HDC4551112mA150°C3.3V

200 MHz (N = 1, N2 = 3,

N3 = 1, M = 75,

FVCO = 600 MHz,

FPLLO = 200 MHz)

Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. Base Idle current (IIDLE) is measured as follows:
    • Oscillator is switched to EC+PLL mode in software
    • OSC1 pin is driven with external 8 MHz square wave with levels from 0.3V to VDD – 0.3V
    • OSC2 is configured as an I/O
    • FSCM is disabled
    • Watchdog Timer is disabled
    • All I/O pins (except OSC1) are configured as outputs and are driving low
    • No peripheral modules are operating or being clocked (defined PMDx bits are all ‘1’s)
    • JTAG is disabled
    • Flash in standby with NVMPIDL = 1
Table 38-6. Power-Down Current (IPD)
DC CharacteristicsSleepStandard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Parameter No.Typ.(1)Max.UnitsConditions
Power-Down Current (IPD)(2)
HDC603890.1mA150°C3.3V
Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. IPD (Sleep) current is measured as follows:
    • CPU core in sleep, oscillator is configured in EC mode and External Clock is active; OSCI is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
    • CLKO is configured as an I/O input pin
    • All I/O pins are configured as output low
    • MCLR = VDD, WDT and FSCM are disabled
    • All peripheral modules are disabled (PMDx bits are all set)
    • JTAG is disabled
Table 38-7. I/O Pin Input Leakage Specifications
Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Param
 No.SymbolCharacteristicMin.Max.UnitsConditions
HDI50IILInput Leakage Current(1)
I/O Pins 5V Tolerant(2)-1.58.5µAVPIN = VSS or VDD
I/O Pins Not 5V Tolerant(2)-1.51.5µA
MCLR-1.58.5µA
OSCI-1.51.5µAMS and HS modes
Note:
  1. Negative current is defined as current sourced by the pin.
  2. See the Pin Diagrams section for the 5V tolerant I/O pins.
Table 38-8. Internal FRC Accuracy

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Parameter No.CharacteristicMin.Max.UnitsConditions
Internal FRC Accuracy @ FRC Frequency = 8 MHz(1)
HF20FRC-33%-40°C ≤ TA ≤ +150°C
HF21BFRC-33%-40°C ≤ TA ≤ +150°C
HF22BFRC/244-LPRC-33%-40°C ≤ TA ≤ +150°C
Note:
  1. Frequency is calibrated at +25°C and 3.3V. TUNx bits can be used to compensate for temperature drift.
Table 38-9. DACx Module Specifications

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Param

No.

SymbolCharacteristicMin.Typ.Max.UnitsComments
HDA05EOFFOffset Error(1)-10—25LSbInternal node at comparator input
HDA06EGGain Error(1)-10—55LSbInternal node at comparator input
Note:
  1. DAC output codes from 5% to 95%. DAC operational at values <5% or >95%. These parameters are characterized but not tested in manufacturing.
Table 38-10. Current Bias Generator Specifications(1)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High temperature

Param No.SymbolCharacteristicMin.Typ.Max.UnitsConditions
HCC03I10SRC10 µA Source Current7—13µAISRCx pin
HCC04ISELOUT0-200 µA Selectable Output Source Current-17—17%IBIASx pin
Note:
  1. Parameters are for design guidance only and are not tested in manufacturing.