50.1 Absolute Maximum Ratings(†)
Parameter | Rating | ||
---|---|---|---|
Ambient temperature under bias | -40°C to +125°C | ||
Storage temperature | -65°C to +150°C | ||
Voltage on pins with respect to VSS | |||
|
-0.3V to +6.5V | ||
|
-0.3V to +9.0V | ||
|
-0.3V to (VDD + 0.3V) | ||
Maximum current(1) | |||
|
-40°C ≤ TA ≤ +85°C | 350 mA | |
85°C < TA ≤ +125°C | 120 mA | ||
|
-40°C ≤ TA ≤ +85°C | 250 mA | |
85°C < TA ≤ +125°C | 85 mA | ||
|
-40°C ≤ TA ≤ +85°C | 350 mA | |
85°C < TA ≤ +125°C | 120 mA | ||
|
±50 mA | ||
Clamp current, IK (VPIN < 0 or VPIN > VDD) | ±20 mA | ||
Total power dissipation(2) | 800 mW |
Note:
- Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations. See the Thermal Characteristics section to calculate device specifications.
- Power dissipation is calculated
as follows:
PDIS = VDD x {IDD - Σ IOH} + Σ {(VDD - VOH) x IOH} + Σ (VOI x IOL)
- Internal Power Dissipation is
calculated as follows:
PINTERNAL = IDD x VDD
- I/O Power Dissipation is
calculated as follows:
PI/O = Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
- Derated Power is calculated as
follows:
PDER = PDMAX(TJ-TA)/θJA
Notice: Stresses above those
listed under the “Absolute Maximum Ratings” section may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those
or any other conditions above those indicated in the operation listings of this
specification is not implied. Exposure above maximum rating conditions for extended
periods may affect device reliability.