2.4.1.1 VREF
(Ask a Question)- The bypass capacitor (10 μF) must be placed near, or at the edge of the device.
- All decoupling capacitors (0.1 μF and 0.01 μF) must be 0402 or of a smaller package size as they are needed to be mounted on the reverse side of the board. They must be fit between the adjacent vias of the BGA package pins. These decoupling capacitors are selected to have a low impedance over the operating frequency and temperature range.
The capacitor pad to via trace must be small. Figure 2-1 shows how these capacitors are mounted. Keep the capacitor pad directly on the corresponding vias.