1 Packaging Overview

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RT PolarFire® SoC FPGAs are available in different variations of a hermetically sealed ceramic and plastic ball grid array packages utilizing flip chip interconnect.

The following table lists the RT PolarFire SoC FPGA variant, with user I/O and XCVR lanes.

Table 1-1. RT PolarFire® SoC FPGA Product Family
Components	Features	RTPFS160ZT	RTPFS460ZT
FPGA Fabric	K Logic Elements (4 LUT + DFF)	161	461
	Math Blocks (18 × 18 MACC)	498	1420
	LSRAM Blocks (20 Kb)	520	1460
	µSRAM Blocks (64 × 12)	1494	4260
	Total RAM (Mb)	11.3	31.6
	µPROM (Kb)	415	553
	User DLLs/PLLs	8	8
Microprocessor Subsystem (MSS)	Boot/Monitor Core	1 × E51 core: RISC-V® RV64IMAC, 625 MHz
	Application Cores	4 × U54 cores; RISC-V RV64GC, 625 MHz
	L2 Cache	2 MB; configurable as cache, Loosely Integrated Memory (LIM) or Scratchpad
	Data Security	DPA-resistant Athena TeraFire® crypto coprocessor available in devices with the suffix "S"
	Ethernet	Yes; 2 × Gigabit Ethernet MAC
	MAC	Yes; MMC 5.1
	CAN	Yes; 2 × CAN
	QSPI	Yes; 1 × QSPI
	SPI	Yes; 2 × SPI
	I²C	Yes; 2 × I²C
	UART	Yes; 5 x UART
	USB	Yes; 1 x USB 2.0 OTG
High-Speed I/O	250 Mbps to 12.7 Gbps SerDes Lanes	8	20
High-Speed I/O	PCIe® Gen2 End Points/Root Ports	2	2
Total FPGA I/O	HSIO + GPIO	312	516
Total MSS I/O	MSS I/O	136	136
MSS DDR DB	MSS DDR Data Bus	32	32
Packaging	Type/Size/Pitch	Total User I/O: MSS-IO/HSIO/GPIO/XCVRs
	FCV(G)784 (23 × 23, 0.8 mm)	136, 144, 168, 8	—
	FC(G)1509 (40 × 40, 1.0 mm)	—	136, 180, 336, 20
	CG1509 (40 × 40, 1.0 mm)	—	136, 180, 336, 20

The following table lists the packages and its application types.

Table 1-2. Package Product Family Table
Package	Description	Size	Pitch	RTPFS160ZT	RTPFS460ZT	Application
FCV784	Plastic Flip Chip Ball Grid Array Package with Eutectic Tin-Lead Solder Balls	23 mm x 23 mm	0.8 mm	✓	—	Flight Prototyping
FCVG784	Plastic Flip Chip Ball Grid Array Package with Lead-Free Solder Balls	23 mm x 23 mm	0.8 mm	✓	—	Flight Prototyping
CG1509	Hermetically Sealed Ceramic Column Grid Array Package	40 mm× 40 mm	1.0 mm	—	✓	Flight Prototyping
LG1509	Hermetically Sealed Ceramic Land Grid Array Package	40 mm× 40 mm	1.0 mm	—	✓	Flight Prototyping
CB1509	Hermetically Sealed Ceramic Ball Grid Array Package	40 mm× 40 mm	1.0 mm	—	✓	Prototyping
FC1509	Plastic Flip Chip Ball Grid Array Package with Eutectic Tin-Lead Solder Balls	40 mm× 40 mm	1.0 mm	—	✓	Flight
FCG1509	Plastic Flip Chip Ball Grid Array Package with Lead-Free Solder Balls	40 mm× 40 mm	1.0 mm	—	✓	Flight

Note: For more information on the package design, see cross-section drawings for the CG, LG, CB and FC packages in the Mechanical Drawings section.