When designing the land pad layout for FC/FCG and CG/CGG packages, it is recommended to have the dimensions as listed in the following table.
The following figure shows the RT PolarFire® SoC package land pad layout for both single trace breakout and dual trace breakout.Figure 13-1. RT PolarFire® SoC Package Land Pad Layout (Single Trace Breakout and Dual Trace Breakout)
Table 13-1. RT PolarFire® SoC Plastic Flip-Chip BGA and Ceramic Column Grid Array Package Land Pad Layout Dimensions
Package
FC1509/FCG1509
CG1509
FCV784/FCVG784
Solder Column/Ball Pitch
1mm
1 mm
0.8 mm
PCB Pad Diameter (SL)
0.50 mm
0.70 mm
0.40 mm
PCB Solder Mask Opening Diameter (SM)
0.60 mm
0.80 mm
0.50 mm
Trace Width (Single and Dual Trace Breakout) (TW)
Determined by the manufacturer based on the application and the design needs
Note: The package layout drawings and dimensions are provided for non-solder mask defined BGA pads which are recommended for the devices.
It is not recommended to have a single land pad layout to accommodate both FC/FCG and CG/CGG packages. While a single land pad array might be used for prototyping, each package configuration must have their own land pad layout to ensure optimized board level system reliability. Plastic flip-chip BGA packages and ceramic column grid packages must not have the same layout for flight modules.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
