5 Package Pin-outs and Pin Compatibility

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The following table lists the packaging pin-outs of the RT PolarFire® SoC device. Detailed PPAT is available for download, and it contains revision history, device specification, power supplies, pin-outs and BGA graphic. For more information about PPAT, see RT PolarFire SoC FPGA Pin Package Assignment Table.

The following table lists the pin compatible packages of RT PolarFire SoC devices.

Table 5-1. Pin Compatible Packages
Package	Devices
RTPFS460ZT	CG1509
	LG1509
	CB1509
	FC1509
	FCG1509
RTPFS160ZT	FCV784
RTPFS160ZT	FCVG784

Note:

FCVG784 is pin compatible between RTPFS160ZT and MPFS160T.
Pin compatibility does not ensure footprint compatibility. While a single land pad array may be used for prototyping, each package configuration should have their own land pad layout to ensure optimized board level system reliability. Plastic flip chip BGA packages and ceramic column grid packages should not have the same layout for flight modules.