11 Packing and Shipping

The RT PolarFire® SoC device is packed in jewel boxes or trays, which are used to pack most of the Microchip surface-mount devices. Trays provide excellent protection from mechanical damage. In addition, they are manufactured using the anti-static material to provide limited protection against Electrostatic Discharge (ESD) damage. The Moisture Sensitivity Level (MSL) of each of these packages is MSL 4.

For more information on how to pack and ship ceramic column grid array packages, see "Section 3, 4 and 5" of Ceramic Column Grid Array.

The following table lists the maximum number of devices packed in a jewel box.
Table 11-1. Maximum Device Counts per Jewel Box
PackageMaximum Number of Devices per Jewel Box
CG15091
LG15091
CB15091
The following table lists the maximum number of devices packed in a tray.
Table 11-2. Maximum Device Counts per Tray
PackageMaximum Number of Devices per Tray
FC150912
FCG150912
FCV78460
FCVG78460