Microchip RT PolarFire® SoC FPGA is available in a lidded Flip-Chip BGA (FCBGA) package. Lidded FCBGA features a controlled bond-line Thermal Interface Material (TIM) thickness that reduces the thermal resistance (Theta-JC) between the junction and the externally applied thermal solution. The lid or heat spreader also spreads the heat away from the die to the package perimeter and to the printed circuit board. Heat is also dissipated through the bottom of the package through the solder balls. The thermal resistance for this is Theta-JB.
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