7 Package Material Information
(Ask a Question)The following table lists the RT PolarFire® SoC package material information.
| Device | RTPFS160ZT | RTPFS460ZT | |||||
|---|---|---|---|---|---|---|---|
| Package | FCV784 | FCVG784 | CG1509 | LG1509 | CB1509 | FC1509 | FCG1509 |
| Package Pitch | 0.8 mm | 0.8 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| Substrate Material | Organic Substrate | Organic Substrate | Alumina (ceramic) | Alumina (ceramic) | Alumina (ceramic) | Organic Substrate | Organic Substrate |
| Solder Ball, Solder Column, or Land Pad Composition | Sn63/Pb37 | Sn96.5/Ag3.0/Cu0.5 | Sn20/Pb80columns with spiral copper foil | Gold-Plated Land Pads | Sn20/Pb80 | Sn63/Pb37 | Sn96.5/Ag3.0/Cu0.5 |
| Solder Bump Composition | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 | Sn98.2/Ag1.8 |
| Lid | AlSiC 4-Post Heat Spreader | AlSiC 4-Post Heat Spreader | Kovar Lid with etched areas | Kovar Lid with etched areas | Kovar Lid with etched areas | AlSiC 12-Post Heat Spreader | AlSiC 12-Post Heat Spreader |