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Ultra Low-Power, 32-bit Cortex-M23 MCUs with TrustZone, Crypto, and Enhanced PTC
Ultra Low-Power, 32-bit Cortex-M23 MCUs with TrustZone, Crypto, and Enhanced PTC
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ATSAML10D14A ATSAML10D15A ATSAML10D16A ATSAML10E14A ATSAML10E15A ATSAML10E16A ATSAML11D14A ATSAML11D15A ATSAML11D16A ATSAML11E14A ATSAML11E15A ATSAML11E16A
  1. Home
  2. 50 Packaging Information
  3. 50.2 Package Drawings
  • Features
  • 1 Configuration Summary
  • 2 Ordering Information
  • 3 Block Diagram
  • 4 Pinouts
  • 5 Signal Descriptions List
  • 6 Power Considerations
  • 7 Analog Peripherals Considerations
  • 8 Device Startup
  • 9 Product Mapping
  • 10 Memories
  • 11 Processor and Architecture
  • 12 Peripherals Configuration Summary
  • 13 SAM L11 Specific Security Features
  • 14 Boot ROM
  • 15 PAC - Peripheral Access Controller
  • 16 Device Service Unit (DSU)
  • 17 Clock System
  • 18 GCLK - Generic Clock Controller

  • 19 MCLK – Main Clock
  • 20 FREQM – Frequency Meter
  • 21 RSTC – Reset Controller
  • 22 PM – Power Manager
  • 23 OSCCTRL – Oscillators Controller
  • 24 OSC32KCTRL – 32KHz Oscillators Controller
  • 25 SUPC – Supply Controller
  • 26 WDT – Watchdog Timer
  • 27 RTC – Real-Time Counter
  • 28 DMAC – Direct Memory Access Controller
  • 29 EIC – External Interrupt Controller
  • 30 NVMCTRL – Nonvolatile Memory Controller
  • 31 TrustRAM (TRAM)
  • 32 PORT - I/O Pin Controller
  • 33 EVSYS – Event System
  • 34 SERCOM – Serial Communication Interface
  • 35 SERCOM USART - SERCOM Synchronous and Asynchronous Receiver and Transmitter
  • 36 SERCOM SPI – SERCOM Serial Peripheral Interface
  • 37 SERCOM I2C – SERCOM Inter-Integrated Circuit
  • 38 TC – Timer/Counter
  • 39 TRNG – True Random Number Generator
  • 40 CCL – Configurable Custom Logic
  • 41 ADC – Analog-to-Digital Converter
  • 42 AC – Analog Comparators
  • 43 DAC – Digital-to-Analog Converter
  • 44 OPAMP – Operational Amplifier Controller
  • 45 PTC - Peripheral Touch Controller
  • 46 Electrical Characteristics
  • 47 125°C Electrical Characteristics
  • 48 AEC-Q100 Grade (-40°C to 125°C) Electrical Characteristics
  • 49 AC and DC Characteristics Graphs
  • 50 Packaging Information
    • 50.1 Package Marking Information
    • 50.2 Package Drawings
      • 50.2.1 32-pin TQFP
      • 50.2.2 24-Pin VQFN
      • 50.2.3 24-pin VQFN with Stepped Wettable Flanks (AEC-Q100 Grade 1)
      • 50.2.4 32-pin VQFN
      • 50.2.5 32-pin VQFN with Stepped Wettable Flanks (AEC-Q100 Grade 1)
      • 50.2.6 24-pin SSOP
      • 50.2.7 32-pin WLCSP
    • 50.3 Soldering Profile
  • 51 Schematic Checklist
  • 52 Conventions
  • 53 Acronyms and Abbreviations
  • 54 Appendix A: Migrating From SAM L21 to SAM L10/L11 (32-pin Package)
  • 55 Appendix B: Migrating From SAM D20/D21 to SAM L10/L11 (32-pin Package)
  • 56 Revision History
  • Legal Disclaimer
  • Microchip Information

50.2 Package Drawings

Note: For current package drawings, refer to the Microchip Packaging Specification, which is available at http://www.microchip.com/packaging.

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.

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