37.4 Power Supply

Table 37-5. Power Supply DC Electrical Specifications
Standard operating conditions: VDDIO = AVDD = 1.8V to 5.5V (Unless otherwise stated)

Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristicsMin.Typ.Max.UnitsConditions
REG_5VDD_CIN(3)VDD Input bypass parallel capacitor pair0.1µFBulk ceramic or solid tantalum capacitor with ESR < 0.5Ω
10nFCeramic X7R capacitor with ESR < 0.5Ω on all VDDIO2 pins
VDDIO2_CIN(3)VDDIO2 Input bypass parallel capacitor pair0.1µFBulk ceramic or solid tantalum capacitor with ESR < 0.5Ω
10nFCeramic X7R capacitor with ESR < 0.5Ω on all VDDIO2 pins
REG_9VREFA_CIN(3)External VREFA Input bypass parallel capacitor pair 0.1µFBulk ceramic or solid tantalum capacitor with ESR < 0.5Ω
10nFCeramic X7R capacitor with ESR < 0.5Ω
REG_17AVDDCIN(3)AVDD Input bypass parallel capacitor pair0.1µFBulk Ceramic or solid tantalum capacitor with ESR < 0.5Ω
10nFCeramic X7R capacitor with ESR < 0.5Ω
REG_23AVDDLEXT(1)AVDD series ferrite bead DC resistance (DCR)0.1≥ 600Ω @ 100 MHz
REG_25Ferrite bead current rating500mA
REG_37VDD(2)VDD input voltage range1.85.5V
REG_37AVDDIO2VDDIO2 input voltage range1.65.5V
REG_39AVDD(2)AVDD input voltage range1.85.5V
REG_40VDDCORE(4)Core voltage2.0VWith AVDD = VDD > 2.4V
REG_43ASVDD_RVDD rise ramp rate required to ensure the internal Power-On Reset signal0.05V/msWith BOD disabled, failure to meet this specification may lead to start-up issues or unexpected behaviors
VDD change rate required to prevent the internal Power-On Reset signal during operation1.2V/µs1.8V ≤ VDD ≤ 5.5V
REG_43BSVDDIO2_RVDDIO2 rise ramp rate required to ensure the internal Power-On Reset signal0.05V/ms
REG_45VPORPower-On Reset1.6VVDD power- up or power-down (see Parameter REG_43, VDD ramp rate)
REG_47VDD / VDDIO2 / AVDD BORVDD / VDDIO2 / AVDD Brown-Out Reset thresholds1.81.92.1VBODLEVEL0
2.32.452.6VBODLEVEL1
2.552.72.85VBODLEVEL2
2.72.853.0VBODLEVEL3
Note:
  1. Ferrite Bead ISAT(min) ≥ (IDDANA(max) x 1.15).
  2. VDD and AVDD must be at the same voltage level.
  3. All bypass capacitors should be located immediately adjacent to pin(s) and on the same side of the PCB as the MCU.
  4. For VDD < 2.4 VDDCORE can be lower than VDD.