10 Package Information
Package Marking Information
| 22-Pin LGA 5.8 mm x 4.9 mm: | Example: | |
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Note: The MCPF1412M06 is engineered for compatibility with
standard surface-mount technology (SMT) assembly methods. It
features a raised footprint, with pads elevated above the
surrounding substrate. The pads are finished with ENEPIG
(Electroless Nickel Electroless Palladium Immersion Gold). Due
to these characteristics, the MCPF1412M06 performs exceptionally well in lead-free
environments. The surface wets easily, and the raised footprint
accommodates processing variations.
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Package Outline Drawing