Thermal Resistance Data
The following table summarizes the thermal resistance data depending on the package.
Table 1.
Thermal Resistance Data
Pin Count
Package Type
θ
JA
[°C/W]
θ
JC
[°C/W]
14
SOIC
58
26
20
SOIC
44
21
20
VQFN
79.7
36
24
VQFN
60.6
25
Parent topic:
Thermal Considerations