43.3.6 Thermal Characteristics

Table 43-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	—	°C/W	8-pin PDIP package
			—	°C/W	8-pin SOIC package
			—	°C/W	8-pin DFN package
			—	°C/W	14-pin PDIP package
			—	°C/W	14-pin SOIC package
			—	°C/W	14-pin TSSOP package
			—	°C/W	16-pin VQFN 4x4 mm package
			—	°C/W	20-pin PDIP package
			—	°C/W	20-pin SOIC package
			—	°C/W	20-pin SSOP package
			—	°C/W	20-pin VQFN 4x4 mm package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
TH03	PD	Power Dissipation	—	W	PD = P_INTERNAL+P_I/O
TH04	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL = I_DD x V_DD⁽¹⁾
TH05	P_I/O	I/O Power Dissipation	—	W	P_I/O = Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH06	P_DER	Derated Power	—	W	P_DER = PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature.