35.2 Absolute Maximum Ratings

Stresses beyond those listed in this section can cause permanent damage to the device and is a stress rating only. The device's functional operation at these, or other conditions beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 35-1. Absolute Maximum Ratings
Parameter	Condition	Rating	Units
Ambient temperature under bias		-40 to +125	°C
Maximum junction temperature		140	°C
Storage temperature		-65 to +150	°C
Voltage on Pins with Respect to GND
On the V_DD pin		-0.3 to +6.0	V
On the RESET pin		-0.3 to 9	V
On all other pins		-0.3 to (V_DD + 0.3)	V
Maximum Current
On the GND pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	200	mA
On the GND pin⁽¹⁾	+85°C < T_A ≤ +125°C	100	mA
On the V_DD pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	200	mA
On the V_DD pin⁽¹⁾	+85°C < T_A ≤ +125°C	100	mA
On any standard I/O pin		±40	mA
Clamp current, I_K (V_PIN < 0 or V_PIN > V_DD)		±20	mA
Total power dissipation⁽²⁾		—	mW
Note: The maximum current rating requires even load distribution across I/O pins. The maximum current rating may be limited by the device package power dissipation characterizations. See the Thermal Characteristics section to calculate device specifications. Calculate power dissipation as follows: P_DIS = V_DD × {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) × I_OH} + Σ (V_OI × I_OL)