35.2 Absolute Maximum Ratings

Stresses beyond those listed in this section can cause permanent damage to the device and is a stress rating only. The device's functional operation at these, or other conditions beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 35-1. Absolute Maximum Ratings
Parameter Condition Rating Units
Ambient temperature under bias -40 to +125 °C
Maximum junction temperature 140 °C
Storage temperature -65 to +150 °C
Voltage on Pins with Respect to GND
  • On the VDD pin
-0.3 to +6.0 V
  • On the RESET pin
-0.3 to 9 V
  • On all other pins
-0.3 to (VDD + 0.3) V
Maximum Current
  • On the GND pin(1)
-40°C ≤ TA ≤ +85°C 200 mA
+85°C < TA ≤ +125°C 100 mA
  • On the VDD pin(1)
-40°C ≤ TA ≤ +85°C 200 mA
+85°C < TA ≤ +125°C 100 mA
  • On any standard I/O pin
±40 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ±20 mA
Total power dissipation(2) mW
Note:
  1. The maximum current rating requires even load distribution across I/O pins. The maximum current rating may be limited by the device package power dissipation characterizations. See the Thermal Characteristics section to calculate device specifications.
  2. Calculate power dissipation as follows: PDIS = VDD × {IDD - Σ IOH} + Σ {(VDD - VOH) × IOH} + Σ (VOI × IOL)