38.13 Serial Peripheral Interface (SERCOM SPI) Mode Electrical Specifications

Figure 38-2. SERCOMn SPI Host Module CPHA = 0 Timing Diagrams
Figure 38-3. SERCOMn SPI Host Module CPHA = 1 Timing Diagrams
Table 38-23. SPIn Module Host Mode Electrical Specifications(1)
Standard Operating Conditions: VDDIO = AVDD = 1.8V to 5.5V (unless otherwise stated)

Operating temperature: -40°C ≤ TA ≤ +125°C for extended temperature

Param. No.SymbolCharacteristics(1)Min.Typ.Max.UnitsConditions
MSP_1fSCKSCK frequency——MHzTransmitter mode, CTRLB.RXEN = 0, CLOAD = 30 pF(max)
——Full-duplex transmit and receive mode, CLOAD = 30 pF(max)

Loopback mode with one SPI communicating with another SPI on the same microcontroller (MCU)

——1/(2 × (tMIS + NOTE2T V))(2)Full-duplex transmit and receive mode, CLOAD = 30 pF(max).

The maximum SPI speed of the MCU is partially dependent on the performance characteristics of the external SPI device.

Therefore, faster speeds than the loopback mode described above may be possible using the formula.

MSP_3tSCLSCK output low time1/(2 × FSCK)——µs—
MSP_5tSCHSCK output high time1/(2 × FSCK)——µs—
MSP_7tSCFSCK and MOSI output fall time——DI_27nsSee parameter DI_27 in the I/O specifications
MSP_9tSCRSCK and MOSI output rise time——DI_25nsSee parameter DI_25 in the I/O specifications
MSP_11tMOVMOSI data output valid after SCK———nsVDDIO(min), CLOAD = 30 pF(max)
MSP_13tMOHMOSI hold after SCK—1—ns
MSP_15tMISMISO setup time of data input to SCK—10—ns
MSP_17tMIHMISO hold time of data input to SCK—10—ns
MSP_19SPIGCLKSERCOM SPI input clk freq, GCLK_SPI——

FCLK_23

MHz—
Note:
  1. All values are characterized but not tested in production. Assumes VDDIOn(min) and a 30 pF external load on all SPIn pins, unless otherwise noted.
  2. tMIS is the master external device setup time.
Figure 38-4. SERCOMn SPI Client Module (CPHA = 0) Timing Diagram
Figure 38-5. SERCOMn SPI Client Module (CPHA = 1) Timing Diagram
Table 38-24. SPIn Module Client Mode Electrical Specifications(1)
Standard Operating Conditions: VDDIO = AVDD = 1.8V to 5.5V (unless otherwise stated)

Operating temperature: -40°C ≤ TA ≤ +125°C for extended temperature

Param. No.SymbolCharacteristics(1)Min.Typ.Max.UnitsConditions
SSP_1fSCKSCK frequency———MHzReceiver mode, CLOAD = 30 pF(max)
———Full-duplex transmit and receive mode, CLOAD = 30 pF(max)

Loopback mode with one SPI communicating with another SPI on the same MCU

——1/(2 × (tSOV + NOTE2_tMIS))(2) Full-duplex transmit and receive mode, CLOAD = 30 pF(max).

The maximum SPI speed of the MCU is partially dependent on the performance characteristics of the external SPI device.

Therefore, faster speeds than those archieved in the loopback mode described above may be possible using the formula.

SSP_3tSCLSCK output low time1/(2 x fSCK)——µs—
SSP_5tSCHSCK output high time1/(2 x fSCK)——µs—
SSP_7tSCFSCK and MOSI output fall time——DI_27nsSee parameter DI_27 in the I/O specifications
SSP_9tSCRSCK and MOSI output rise time——DI_25nsSee parameter DI_25 in the I/O specifications
SSP_11tSOVMISO data output valid after SCK—10—nsVDD(min), CLOAD = 30 pF(max)
SSP_13tSOHMISO hold after SCK—13—ns
SSP_15tSISMOSI setup time of data input to SCK3——ns
SSP_17tSIHMOSI hold time of data input to SCKtCLK_PER——ns
SSP_19tSSSSS setup to SCK (PRELOADEN = 1)21——ns
SS setup to SCK (PRELOADEN = 0)21——ns
SSP_21tSSHSS hold after SCK client20——ns
SSP_23SPIGCLKSERCOM SPI input clk freq, GCLKSPI——FCLK_23MHz—
Note:
  1. All values are characterized but not tested in production. Assumes using VDDIOn(min) and a 30 pF external load on all SPIn pins unless otherwise noted.
  2. tMIS is the setup time for the host external device.