51 Appendix A: Regulatory Approval

The PIC32WM-BZ6204UC Module has received regulatory approval for the following countries:
  • United States/FCC ID: 2ADHKBZ6204
  • Canada/ISED:
    • IC: 20266-BZ6204
    • HVIN: PIC32WM-BZ6204UC
    • PMN: Wireless MCU Module with Bluetooth® Low Energy 6.0 qualified, IEEE® 802.15.4
  • Europe/CE
  • Great Britain/UKCA
  • Japan/MIC: 020-250238
  • Korea/KCC: R-R-mcp-BZ6204
  • Taiwan/NCC: CCAN25Y10930T0
The PIC32WM-BZ6204UE Module has received regulatory approval for the following countries:
  • United States/FCC ID: 2ADHKBZ6204
  • Canada/ISED:
    • IC: 20266-BZ6204
    • HVIN: PIC32WM-BZ6204UE
    • PMN: Wireless MCU Module with Bluetooth® Low Energy 6.0 qualified, IEEE® 802.15.4
  • Europe/CE
  • Great Britain/UKCA
  • Japan/MIC: 020-250238
  • Korea/KCC: R-R-mcp-BZ6204
  • Taiwan/NCC: CCAN25Y10931T2
  • China/SRRC: 25J999P60770 (M)
The PIC32WM-BZ6602CC Module has received regulatory approval for the following countries:
  • United States/FCC ID: 2ADHKBZ6602
  • Canada/ISED:
    • IC: 20266-BZ6602
    • HVIN: PIC32WM-BZ6602CC
    • PMN: Wireless MCU Module with Bluetooth® Low Energy 6.0 qualified, IEEE® 802.15.4
  • Europe/CE
  • Great Britain/UKCA
The PIC32WM-BZ6602CE Module has received regulatory approval for the following countries:
  • United States/FCC ID: 2ADHKBZ6602
  • Canada/ISED:
    • IC: 20266-BZ6602
    • HVIN: PIC32WM-BZ6602CE
    • PMN: Wireless MCU Module with Bluetooth® Low Energy 6.0 qualified, IEEE® 802.15.4
  • Europe/CE
  • Great Britain/UKCA