33.10 Parallel Programming Characteristics

Table 33-11. Parallel Programming Characteristics, VCC = 5V ± 10%
SymbolParameterMin.Max.Units
VPPProgramming Enable Voltage11.512.5V
IPPProgramming Enable Current-250μA
tDVXHData and Control Valid before XTAL1 High67-ns
tXLXHXTAL1 Low to XTAL1 High300-ns
tXHXLXTAL1 Pulse Width High150-ns
tXLDXData and Control Hold after XTAL1 Low67-ns
tXLWLXTAL1 Low to WR Low0-ns
tXLPHXTAL1 Low to PAGEL high0-ns
tPLXHPAGEL low to XTAL1 high150-ns
tBVPHBS1 Valid before PAGEL High67-ns
tPHPLPAGEL Pulse Width High200-ns
tPLBXBS1 Hold after PAGEL Low67-ns
tWLBXBS2/1 Hold after RDY/BSY high67-ns
tPLWLPAGEL Low to WR Low67-ns
tBVWLBS1 Valid to WR Low67-ns
tWLWHWR Pulse Width Low150-ns
tWLRLWR Low to RDY/BSY Low01μs
tWLRHWR Low to RDY/BSY High(1)24.5ms
tWLRH_CEWR Low to RDY/BSY High for Chip Erase(2)7.512ms
tXLOLXTAL1 Low to OE Low0-ns
tBVDVBS1 Valid to DATA valid0500ns
tOLDVOE Low to DATA Valid-500ns
tOHDZOE High to DATA Tri-stated-500ns
Note:
  1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock bits commands.
  2. tWLRH_CE is valid for the Chip Erase command.
Figure 33-6. Parallel Programming Timing, Including Some General Timing Requirements
Figure 33-7. Parallel Programming Timing, Loading Sequence With Timing Requirements
Note: The timing requirements shown in Parallel Programming Characteristics (i.e., tDVXH, tXHXL, and tXLDX) also apply to loading operation.
Figure 33-8. Parallel Programming Timing, Reading Sequence (Within the Same Page) With Timing Requirements
Note: The timing requirements shown in Parallel Programming Characteristics (i.e., tDVXH, tXHXL, and tXLDX) also apply to reading operation.