1.3.1 Device Reset Induced VDD Surge Current
(Ask a Question)After device power-up, if the application asserts the DEVRST_N pin, a surge current on VDD may be observed. This section describes how to minimize additional surge current during the device reset operation. This additional surge current does not occur during device power-up; it is applicable only when DEVRST_N is asserted.
SmartFusion 2/IGLOO 2 device reset can be activated either directly through an external DEVRST_N pin or indirectly through the tamper macro IP. When the device reset is asserted, the system controller immediately puts the FPGA core in the inactive state, which induces a temporary current demand on VDD. This surge current is for a very short duration and is normally handled by bulk decoupling capacitors on the power plane in a typical system. In cases where Microchip-recommended board design guidelines cannot be implemented for decoupling capacitors for VDD (due to limited board spacing or other reasons), higher-than-expected surge current may occur during device reset.
Device | Width of Surge at 50% of Pulse (µS) | Surge Current on VDD | Units | ||
---|---|---|---|---|---|
0 °C to 85 °C | –40 °C to 100 °C | –55 °C to 125 °C | |||
M2S005/M2GL005 | 2 | 0.5 | 0.6 | 0.6 | A |
M2S010/M2GL010 | 3 | 0.9 | 0.9 | 0.9 | A |
M2S025/M2GL025 | 6 | 1.7 | 1.7 | 1.7 | A |
M2S050/M2GL050 | 12 | 3.2 | 3.2 | 3.2 | A |
M2S060/M2GL060 | 12 | 3.2 | 3.2 | 3.2 | A |
M2S090/M2GL090 | 22 | 4.4 | 4.6 | 4.6 | A |
M2S150/M2GL150 | 42 | 7.0 | 7.3 | 7.3 | A |
Kit | Width of Surge at 50% of Pulse | Surge Current |
---|---|---|
M2S090 Security Evaluation Kit | 5 µs | 150 mA |
M2S150 Advanced Development Kit | 40 µs | 1.5A |
- The amount of bulk capacitance placed for VDD was 1–100 µF, 3–220 µF, and 1–330 µF.