34.1 DC Characteristics

Table 34-2. Operating MIPS vs. Voltage
VDD RangeTemperature RangeMaximum CPU Clock Frequency
3.0V to 3.6V-40°C to +150°C70 MIPS
Table 34-3. Thermal Operating Conditions
RatingSymbolMin.Max.Unit
High-Temperature Devices
Operating Junction Temperature RangeTJ-40+165°C
Operating Ambient Temperature RangeTA-40+150°C
Power Dissipation:

Internal Chip Power Dissipation:

Pint = VDD x (IDD – Σ IOH)

PDPINT + PI/OW
I/O Pin Power Dissipation:

I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 34-4. Thermal Packaging Characteristics(1)
CharacteristicSymbolTyp.Unit
Package Thermal Resistance, 80-Pin TQFP

12x12x1 mm

θJA50.67°C/W
Package Thermal Resistance, 64-Pin TQFP

10x10x1.0 mm

θJA45.7°C/W
Package Thermal Resistance, 64-Pin QFN 9x9 mmθJA18.7°C/W
Package Thermal Resistance, 48-Pin TQFP 7x7 mmθJA62.76°C/W
Package Thermal Resistance, 48-Pin UQFN 6x6 mmθJA27.6°C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JAJA) numbers are achieved by package simulations.
Table 34-5. Operating Voltage Specifications(2)
Operating Conditions: 3.0V to 3.6V (unless otherwise stated)(1)

Operating temperature -40°C ≤ TA ≤ +150°C

Param No.SymbolCharacteristicMin.Typ.(2)Max.UnitsConditions
Operating Voltage
HDC10VDDSupply Voltage3.03.6V
HDC11AVDDSupply VoltageGreater of:
VDD – 0.3 or 3.0Lesser of:
VDD + 0.3 or 3.6VThe difference between AVDD supply and VDD supply must not exceed ±300 mV at all times, including during device power-up
HDC16VPORVDD Start Voltage
 to Ensure Internal 
Power-on Reset SignalVSSV
HDC17SVDDVDD Rise Rate
 to Ensure Internal
Power-on Reset Signal0.03V/ms0V-3V in 100 ms
HBO10VBORBOR Event on VDD Transition High-to-Low2.682.842.99V
Note:
  1. Device is functional at VBORMIN < VDD < VDDMIN. Analog modules (ADC and comparators) may have degraded performance.
  2. Parameters are characterized but not tested.
Table 34-6. DC Characteristics: Operating Current (IDD)(2)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.(1)Max.UnitsConditions
HDC2016.533.5mA+150°C3.3V10 MIPS (N1 = 1, N2 = 5, N3 = 2, 
M = 50, FVCO = 400 MHz, 
FPLLO = 40 MHz)
HDC2118.436mA+150°C3.3V20 MIPS (N1 = 1, N2 = 5, N3 = 1, 
M = 50, FVCO = 400 MHz, 
FPLLO = 80 MHz)
HDC2222.740mA+150°C3.3V40 MIPS (N1 = 1, N2 = 3, N3 = 1, 
M = 60, FVCO = 480 MHz, 
FPLLO = 160 MHz)
HDC2328.748mA+150°C3.3V70 MIPS (N1 = 1, N2 = 2, N3 = 1, 
M = 70, FVCO = 560 MHz, 
FPLLO = 280 MHz)
Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. Base Run current (IDD) is measured as follows:
    • Oscillator is switched to EC+PLL mode in software
    • OSC1 pin is driven with external 8 MHz square wave with levels from 0.3V to VDD – 0.3V
    • OSC2 is configured as an I/O in the Configuration Words (OSCIOFNC (FOSC[2]) = 0)
    • FSCM is disabled (FCKSM[1:0] (FOSC[7:6]) = 01)
    • Watchdog Timer is disabled (FWDT[15] = 0 and WDTCONL[15] = 0)
    • All I/O pins (except OSC1) are configured as outputs and driving low
    • No peripheral modules are operating or being clocked (defined PMDx bits are all ‘1’s)
    • JTAG is disabled (JTAGEN (FICD[5]) = 0)
    • NOP instructions are executed in while(1) loop
Table 34-7. DC Characteristics: Idle Current (IIDLE)(2)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Param No.Typ.(1)Max.UnitsConditions
HDC4015.433.3mA+150°C3.3V

10 MIPS (N1 = 1, N2 = 5,

N3 = 2, M = 50,

FVCO = 400 MHz,

FPLLO = 40 MHz)

HDC4116.133.8mA+150°C3.3V

20 MIPS (N1 = 1, N2 = 5,

N3 = 1, 
M = 50,

FVCO = 400 MHz,

FPLLO = 80 MHz)

HDC4217.936.3mA+150°C3.3V

40 MIPS (N1 = 1, N2 = 3,

N3 = 1, 
M = 60,

FVCO = 480 MHz,

FPLLO = 160 MHz)

HDC4320.439.8mA+150°C3.3V

70 MIPS (N1 = 1, N2 = 2,

N3 = 1, 
M = 70,

FVCO = 560 MHz,

FPLLO = 280 MHz)

Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. Base Idle current (IIDLE) is measured as follows:
    • Oscillator is switched to EC+PLL mode in software
    • OSC1 pin is driven with external 8 MHz square wave with levels from 0.3V to VDD – 0.3V
    • OSC2 is configured as an I/O in the Configuration Words (OSCIOFNC (FOSC[2]) = 0)
    • FSCM is disabled (FCKSM[1:0] (FOSC[7:6]) = 01)
    • Watchdog Timer is disabled (FWDT[15] = 0 and WDTCONL[15] = 0)
    • All I/O pins (except OSC1) are configured as outputs and driving low
    • No peripheral modules are operating or being clocked (defined PMDx bits are all ‘1’s)
    • JTAG is disabled (JTAGEN (FICD[5]) = 0)
    • Flash in standby with NVMSIDL (NVMCON[12]) = 1
Table 34-8. Power-Down Current (IPD)(2)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.CharacteristicTyp.(1)Max.UnitsConditions
HDC60Base Power-Down Current11.629.2mA+150°C3.3V
Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
  2. IPD (Sleep) current is measured as follows:
    • CPU core is off, oscillator is configured in EC mode and External Clock is active; OSCI is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
    • CLKO is configured as an I/O input pin in the Configuration Word
    • All I/O pins are configured as output low
    • MCLR = VDD, WDT and FSCM are disabled
    • All peripheral modules are disabled (PMDx bits are all set)
    • The VREGS bit (RCON[8]) = 0 (i.e., core regulator is set to standby while the device is in Sleep mode)
    • JTAG is disabled
Table 34-9. Doze Current (IDOZE)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.(1)Max.Doze RatioUnitsConditions
HDC7023.6431:2mA+150°C3.3V

70 MIPS (N = 1,

N2 = 2, N3 = 1,

M = 70, FVCO = 560 MHz,

FPLLO = 280 MHz)

18.538.71:128mA
Note:
  1. Data in the “Typ.” column are for design guidance only and are not tested.
Table 34-10. Watchdog Timer Delta Current (ΔIWDT)(1)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.(1)Max.UnitsConditions
HDC61100600µA+150°C3.3V
Note:
  1. The ΔIWDT current is the additional current consumed when the module is enabled. This includes the LPRC/ BFRC clock source current. This current should be added to the base IPD current. All parameters are characterized but not tested during manufacturing.
Table 34-11. PWM Delta Current(1)

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.Max.UnitsConditions
HDC100710mA+150°C3.3V

PWM Output Frequency = 500 kHz,


PWM Input (AFPLLO = 500 MHz)


(AVCO = 1000 MHz,

PLLFBD = 125,

APLLDIV1 = 2)

HDC10167.5mA+150°C3.3V

PWM Output Frequency = 500 kHz,


PWM Input (AFPLLO = 400 MHz)

(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 1)

HDC10234mA+150°C3.3V

PWM Output Frequency = 500 kHz,

PWM Input (AFPLLO = 200 MHz)

(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 2)

HDC10322.5mA+150°C3.3V

PWM Output Frequency = 500 kHz,

PWM Input (AFPLLO = 100 MHz)

(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 4)

Note:
  1. APLL current is not included. The APLL current will be the same if more than one PWM is running. Listed delta currents are for only one PWM instance when HREN = 0 (PGxCONL[7]). All parameters are 
characterized but not tested during manufacturing.
Table 34-12. APLL Delta Current

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.Max.UnitsConditions(1)
HDC110918mA+150°C3.3V

AFPLLO = 500 MHz

(AVCO = 1000 MHz,

PLLFBD = 125,

APLLDIV1 = 2)

HDC11169mA+150°C3.3V

AFPLLO = 400 MHz

(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 1)

HDC11258mA+150°C3.3V

AFPLLO = 200 MHz


(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 2)

HDC11348mA+150°C3.3V

AFPLLO = 100 MHz


(AVCO = 400 MHz,

PLLFBD = 50,

APLLDIV1 = 4)

Note:
  1. The APLL current will be the same if more than one PWM or DAC is run to the APLL clock. All parameters are characterized but not tested during manufacturing.
Table 34-13. ADC Delta Current

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.Max.UnitsConditions
HDC1208.5mA+150°C3.3VTAD = 14.3 ns
 (3.5 Msps conversion rate)
Table 34-14. Comparator + DAC Delta Current

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Parameter No.Typ.Max.UnitsConditions
HDC1305mA+150°C3.3VAFPLLO @ 500 MHz(1)
Note:
  1. APLL current is not included. Listed delta currents are for only one comparator + DAC instance. All 
parameters are characterized but not tested during manufacturing.
Table 34-15. I/O Pin Input Specifications

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Param
 No.SymbolCharacteristicMin.(4)Typ.(1)Max.(5)UnitsConditions
HDI50IILInput Leakage Current(2)
I/O Pins 5V Tolerant(3)-15001500nA
I/O Pins Not 5V Tolerant(3)-700700nA
MCLR-15001500nA
OSCI-750750nAXT and HS modes
Note:
  1. Data in the “Typ.” column are at 3.3V, +25°C unless otherwise stated.
  2. Negative current is defined as current sourced by the pin.
  3. See the “Pin Diagrams” section for the 5V tolerant I/O pins.
  4. VPIN = VSS.
  5. VPIN = VDD.
Table 34-16. Internal FRC Accuracy

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Param No.CharacteristicMin.Max.UnitsConditions
Internal FRC Accuracy @ FRC Frequency = 8 MHz(1)
HF20FRC33%-40°C ≤ TA ≤ +150°C
Note:
  1. Frequency is calibrated at +25°C and 3.3V.
Table 34-17. Internal LPRC Accuracy

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Param
No.CharacteristicMin.Max.UnitsConditions
LPRC @ 32 kHz
HF21LPRC-27+27%-40°C ≤ TA ≤ +150°C
-25+25%-40°C ≤ TA ≤ 0°C
-10+10%0°C ≤ TA ≤ +85°C
-15+15%+85°C ≤ TA ≤ +125°C
Table 34-18. DACx Module Specifications

Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C

Param

No.

SymbolCharacteristicMin.Typ.(1)Max.UnitsComments
HDA03INLIntegral Nonlinearity Error-500LSB
HDA05EOFFOffset Error-3.545LSBInternal node at comparator input
HDA06EGGain Error050LSBInternal node at comparator input
Note:
  1. Parameters are for design guidance only and are not tested in manufacturing.