14 Document Revision History


Revision	Date	Section	Description
B	05/2021	Document	Replaced the Master/Slave terminologies. For more details, see the following note.
		Introduction	Updated peripheral details
		Features	Added operating conditions
		Ordering Information and IC Marking	Updated with additional ordering code and description in the Table 1-1
		CPU and Memory Subsystem	Errors in description fixed and added additional information in Nonvolatile Memory (eFuse)
		Reference Documentation	Added Deriving a Gain Table App Note to the Table 13-1
A	06/2020	Document	Updated from Atmel to Microchip template. Assigned a new Microchip document number. Previous version is Atmel 42390 revision D. ISBN number added.
		Functional Overview	Rearranged sections under this chapter Updated Figure 2-1 Updated descriptions of the pins in Pinout Details Updated pad width in Table 2-2
		Nonvolatile Memory (eFuse)	Updated with new information and Figure 4-1
		WLAN Subsystem	Added a note for firmware support of Short GI Updated Table 5-1
		External Interfaces	Updated lead sentence Minor edits Added Interfacing with Host Microcontroller
		Electrical Characteristics	Updated Table 9-9
		Reference Design	Updated Figure 10-1 and Figure 10-2 Added Table 10-1 and updated contents
		Design Considerations	Added a new chapter
		Reference Documentation	Updated Table 13-1

Note: Microchip is aware that some terminologies used in the technical documents and existing software codes of this product are outdated and unsuitable. This document may use these new terminologies, which may or may not reflect on the source codes, software GUIs, and the documents referenced within this document. The following table shows the relevant terminology changes made in this document.

Table 14-1. Terminology Related Changes
Old Terminology	New Terminology	Description
Master	Host	The following sections are updated with new terminology: Pinout Details External Interfaces Interfacing with Host Microcontroller I²C Client Interface SPI Client Interface SDIO Client Interface I²C Client Interface Timing Diagram SPI Client Interface Timing Diagram SDIO Client Interface Timing Diagram
Slave	Client

Atmel Revision History

Rev D – 05/2016


Section	Changes
Document	Updated Features, Bluetooth® to say Bluetooth 4.0 (Basic Rate, Enhanced Rate and BLE). Added Bluetooth Certifications. Replaced VBATT with VBAT to match schematics. Revised Package information in Table 3-2. Revised PPM values from 200 to 500 ppm in Chapter 5. Revised Table 7-2 transmitter performance values and Note 2. Revised the values and note in Table 8-2. Revised SPI Slave Timing parameters in Table 9-6. Revised SPI Master Timing parameters in Table 9-8. Revised SDIO Slave Timing parameters in Table 9-10. Added text in Section 9.6 regarding flow control usage. Revised Current consumption values in Table 10-2. Updated Package drawing to include solder paddle pad in Figure 3-2. Added Reflow profile in Chapter 13. Revised tolerance for thickness in Table 3-2 for QFN package information. Added footnote for Pull-up/Pull-Down Ohm value in Table 10-4.

Rev C - 07/2015


Section	Changes
Document	Modified sections 10.2.1 and 10.2.2 to add new current consumption numbers, update state names and correct some typos. Fixed typos for SPI Slave interface timing in Table 9-6. Fixed typos for battery supply name: changed from VBAT to VBATT. Corrected PMU output voltages in Table 10-1. Updated reference schematic drawing in Section 11. Added comment regarding resistors on SDIO pins in Section 12. Updated power architecture drawing in Section 10.1. Added pad drive strength in Table 4-3 and removed the note under Table 3-1. Updated operating temperature in the feature list. Corrected current in Power_Down state in Table 10-2. Miscellaneous minor formatting and content corrections.

Rev B - 03/2015


Section	Changes
Document	DS update new Atmel format.

Rev A - 01/2015


Section	Changes
Document	Initial Release