46.22 Serial Peripheral Interface (SPI) Timings Electrical Characteristics

Figure 46-8. SPIx Host Module (CPHA = 0) Timing Diagrams

Figure 46-9. SPIx Host Module (CPHA = 1) Timing Diagrams

Table 46-32. SPIx Module Host Mode Electrical Specifications ⁽¹⁾
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics ⁽¹⁾		Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	22	MHz	Transmitter mode, CTRB.RXEN = 0. CLOAD = 30 pF(max)
				—	—	22		Full Duplex Transmit and Receive mode, Loop-Back mode with one SPI talking to another SPI on the same MCU. CLOAD = 30 pF(max)
				—	—	1/(2*(TMIS+NOTE2_TV)) ⁽²⁾		Full Duplex Transmit and Receive mode, CLOAD = 30 pF (max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High-Speed SERCOM ⁽³⁾	—	—	46	MHz	Transmitter mode, CTRB.RXEN = 0, VDDIOx >= 2.97V, CLOAD = 20 pF(max)
			High-Speed SERCOM ⁽³⁾	—	—	1/(2*(TMIS_HS+NOTE2_TV)) ⁽²⁾	MHz	Full-Duplex Transmit and Receive mode, CLOAD=20 pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop- Back mode above may therefore be possible using the formula. VDDIOx >= 2.97V
MSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	ns	—
MSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	ns	—
MSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O Specifications
MSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O Specifications
MSP_11	TMOV	MOSI Data Output Valid after SCK	Normal Speed SERCOM	—	—	9.56	ns	—
MSP_11	TMOV	MOSI Data Output Valid after SCK	High-Speed SERCOM ⁽³⁾	—	—	2.94	ns	VDDIOx >= 2.97V
MSP_13	TMOH	MOSI hold after SCK		0	—	—	ns	—
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	Normal Speed SERCOM	12.8	—	—	ns	—
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	High-Speed SERCOM⁽³⁾	1.31	—	—	ns	VDDIOx >= 2.97V
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	Normal Speed SERCOM	0	—	—	ns	—
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	1.49	—	—	ns	VDDIOx >= 2.97V
MSP_19	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI		—	—	FCLK_23	MHz	—
Note: Assumes 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the client external device data output valid time from clock edge specification. SERCOM0 pins PC0,PC1,PC2,PC3.

Figure 46-10. SPIx Client Module (CPHA = 0) Timing Diagrams

Figure 46-11. SPIx Client Module (CPHA = 1) Timing Diagrams

Table 46-33. SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics ⁽¹⁾		Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	22	MHz	Receiver mode. CLOAD = 30 pF(max)
				—	—	22		Full Duplex Transmit and Receive mode, Loop-Back mode with one SPI talking to another SPI on the same MCU. CLOAD = 30 pF(max)
				—	—	1/(2*(TSOV+NOTE2_TMIS)) ⁽²⁾		Full Duplex Transmit and Receive mode, CLOAD=30 pF(max). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High-Speed SERCOM ⁽³⁾	—	—	46	MHz	Receiver mode. VDDIOx >= 2.97V, CLOAD = 20 pF(max)
			High-Speed SERCOM ⁽³⁾	—	—	1/(2*(TSOV_HS+NOTE2_TMIS)) ⁽²⁾	MHz	Full Duplex Transmit and Receive mode, CLOAD=20 pF(max). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the loop back mode above may therefore be possible using the formula. VDDIOx>=2.97V
SSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	ns	—
SSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	ns	—
SSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O Specifications
SSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O Specifications
SSP_11A	TSOV	MISO Data Output Valid after SCK	Normal- Speed SERCOM	—	—	14.83	ns	—
SSP_11A	TSOV	MISO Data Output Valid after SCK	High-Speed SERCOM ⁽³⁾	—	—	10.52	ns	VDDIOx>= 2.97V
SSP_13	TSOH	MISO Hold after SCK		4	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	Normal- Speed SERCOM	7.33	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	High-Speed SERCOM ⁽³⁾	2.22	—	—	ns	VDDIOx>= 2.97V
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	Normal Speed SERCOM	2.24	—	—	ns	—
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	High-Speed SERCOM ⁽³⁾	1.92	—	—	ns	VDDIOx>= 2.97V
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 0)	Normal Speed SERCOM	5.76	—	—	ns	—
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 0)	High-Speed SERCOM ⁽³⁾	1.47	—	—	ns	VDDIOx>= 2.97V
SSP_21	TSSH	SS hold after SCK Client	Normal Speed SERCOM	0	—	—	ns	—
SSP_21	TSSH	SS hold after SCK Client	High-Speed SERCOM ⁽³⁾	0.36	—	—	ns	VDDIOx>=2.97V
SSP_23	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI	—	—	—	FCLK_23	MHz	—
Note: Assumes 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the host external device setup time. SERCOM0 pins PC0,PC1,PC2,PC3.