46.2 CPU Electrical Characteristics

Table 46-3. Operating Frequency vs Voltage
Param. No.VDDIOx, AVDD RangeTemp. Range (in °C)Max MCU FrequencyComments
DC_51.71 to 3.63V-40°C to +85°CFCLK_1 MHzIndustrial
Table 46-4. MCU Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices Operating Ambient Temperature Range Operating Junction Temperature RangeTA

TJ

-40

—

—85

105

°C

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIOx x (IDD –∑ IOHVDDIOx))+ (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG)

I/O Pin Power Dissipation:

PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 46-5. Thermal Packaging Characteristics (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 48-pin TQFP (7x7x1 mm) PackageθJA47.0—°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) PackageθJA44.8—°C/W
Thermal Resistance, 100-pin TQFP (14x14x1 mm) PackageθJA41.1—°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) PackageθJA22.3—°C/W
Thermal Resistance, 64-pin VQFN (9x9x1 mm) PackageθJA20.5—°C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.