48.22 Serial Peripheral Interface (SPI) Timings Electrical Characteristics

Figure 48-17. SPIx Host Module (CPHA = 0) Timing Diagrams

Figure 48-18. SPIx Host Module (CPHA = 1) Timing Diagrams

Table 48-32. SPIx Module Host Mode Electrical Specifications ⁽¹⁾
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics ⁽¹⁾		Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	22	MHz	Transmitter mode, CTRB.RXEN = 0. CLOAD = 30 pF (max.)
				—	—	22		Full-Duplex Transmit and Receive mode, Loop-Back mode with one SPI talking to another SPI on the same MCU. CLOAD = 30 pF (max.)
				—	—	1/(2*(TMIS+NOTE2_TV)) ⁽²⁾		Full- Duplex Transmit and Receive mode, CLOAD = 30 pF (max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High-Speed SERCOM ⁽³⁾	—	—	46	MHz	Transmitter mode, CTRB.RXEN = 0, VDDIOx >= 2.97V, CLOAD = 20 pF (max.)
			High-Speed SERCOM ⁽³⁾	—	—	1/(2*(TMIS_HS+NOTE2_TV)) ⁽²⁾	MHz	Full-Duplex Transmit and Receive mode, CLOAD=20 pF (max.) The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop- Back mode above may therefore be possible using the formula. VDDIOx >= 2.97V
MSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	ns	—
MSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	ns	—
MSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O Specifications
MSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O Specifications
MSP_11	TMOV	MOSI Data Output Valid after SCK	Normal Speed SERCOM	—	—	9.56	ns	—
MSP_11	TMOV	MOSI Data Output Valid after SCK	High Speed SERCOM ⁽³⁾	—	—	2.94	ns	VDDIOx >= 2.97V
MSP_13	TMOH	MOSI Hold after SCK		0	—	—	ns	—
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	Normal Speed SERCOM	12.8	—	—	ns	—
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	High Speed SERCOM⁽³⁾	1.31	—	—	ns	VDDIOx >= 2.97V
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	Normal Speed SERCOM	0	—	—	ns	—
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	1.49	—	—	ns	VDDIOx >= 2.97V
MSP_19	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI		—	—	FCLK_23	MHz	—
Note: Assumes 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the client external device data output valid time from clock edge specification. SERCOM0 pins PC0,PC1,PC2,PC3.

Figure 48-19. SPIx Client Module (CPHA = 0) Timing Diagrams

Figure 48-20. SPIx Client Module (CPHA = 1) Timing Diagrams

Table 48-33. SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics ⁽¹⁾		Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	22	MHz	Receiver mode. CLOAD = 30 pF(max)
				—	—	22		Full Duplex Transmit and Receive mode, Loop-Back mode with one SPI talking to another SPI on the same MCU. CLOAD = 30 pF (max)
				—	—	1/(2*(TSOV+NOTE2_TMIS)) ⁽²⁾		Full Duplex Transmit and Receive mode, CLOAD=30 pF (max.) The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High Speed SERCOM ⁽³⁾	—	—	46	MHz	Receiver mode. VDDIOx >= 2.97V, CLOAD = 20 pF (max)
			High Speed SERCOM ⁽³⁾	—	—	1/(2*(TSOV_HS+NOTE2_TMIS)) ⁽²⁾	MHz	Full Duplex Transmit and Receive mode, CLOAD = 20 pF (max.). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop- Back mode above may therefore be possible using the formula. VDDIOx>=2.97V
SSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	ns	—
SSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	ns	—
SSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O Specifications
SSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O Specifications
SSP_11A	TSOV	MISO Data Output Valid after SCK	Normal Speed SERCOM	—	—	14.83	ns	—
SSP_11A	TSOV	MISO Data Output Valid after SCK	High Speed SERCOM ⁽³⁾	—	—	10.52	ns	VDDIOx>= 2.97V
SSP_13	TSOH	MISO Hold after SCK		4	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	Normal Speed SERCOM	7.33	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	2.22	—	—	ns	VDDIOx >= 2.97V
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	Normal Speed SERCOM	2.24	—	—	ns	—
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	1.92	—	—	ns	VDDIOx >= 2.97V
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 0)	Normal Speed SERCOM	5.76	—	—	ns	—
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 0)	High Speed SERCOM ⁽³⁾	1.47	—	—	ns	VDDIOx >= 2.97V
SSP_21	TSSH	SS hold after SCK Client	Normal Speed SERCOM	0	—	—	ns	—
SSP_21	TSSH	SS hold after SCK Client	High-Speed SERCOM ⁽³⁾	0.36	—	—	ns	VDDIOx>=2.97V
SSP_23	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI	—	—	—	FCLK_23	MHz	—
Note: Assumes 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the host external device setup time. SERCOM0 pins PC0,PC1,PC2,PC3.