43.4 Thermal Specifications

Table 43-4. Thermal Operating Conditions
RatingSymbolMin.TypMax.Unit
Industrial Temperature Devices:
Operating ambient temperature rangeTA-40—+85°C
Operating junction temperature rangeTJ-40—+95°C
Extended Temperature Range:
Operating ambient temperature rangeTA-40—+125°C
Operating junction temperature rangeTJ-40—+135°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIOx x (IDD –∑ IOH))

I/O Pin Power Dissipation:

PI/O = ∑ (({VDDIO – VOH} x IOH) + ∑ (VOL x IOL))

PDPINT + PI/OW
Maximum allowed power dissipationPDMAX(TJ – TA)/ϴJAW
Note: The WBZ35x Module supports -40°C to +85°C.
Table 43-5. Thermal Packaging Characteristics
CharacteristicsSymbolTypMax.Unit

Thermal Resistance, 48-pin VQFN (6 mm x 6 mm x 0.9 mm) Package

ϴJA<18—°C/W
Thermal Resistance, 32-pin VQFN (5 mm x 5 mm x 0.9 mm) PackageϴJA<18—°C/W
Note: The junction-to-ambient thermal resistance, ϴJA, numbers are achieved by package simulations.