For the best chip antenna performance, place the
PIC32WM-BZ6602 Module at the edge of the host board.
For best performance, keep metal structures and components (such as mechanical spacers,
bump-on and so on) at least 31.75 mm away from the chip antenna of the PIC32WM-BZ6602 Module (see the following figure).
Do not place the antenna on the PIC32WM-BZ6602 Module in direct
contact with or in close proximity to plastic casing or objects. Ensure to keep a clearance
of 10 mm in all directions around the chip antenna (see the following figure). Keeping
metallic and plastic objects close to the antenna can detune the antenna and reduce the
performance of the device.
A low-impedance ground plane for the PIC32WM-BZ6 Module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
Exposed GND pads on the bottom of the PIC32WM-BZ6 Module must be soldered to the host board (see Example of Host Board on Top Layer figure in the PIC32WM-BZ6 Module Routing Guidelines from Related Links).
A PCB cutout or a copper keepout is required
under RF test point. See PIC32WM-BZ6 Module Packaging
Information from Related Links.
Copper keepout areas are required on the top
layer under voltage test points. See PIC32WM-BZ6 Module
Packaging Information from Related Links.
On the other hand, the entire region except the exposed ground paddle can be solder-masked.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
