74.7.9 Main Crystal Oscillator

Table 74-54. Main Crystal Oscillator Characteristics
Symbol Parameter Conditions Min Max Unit
VDDIN33 Supply voltage range (VDDIN33)(1) 3.0 3.6 V
IVDDIN33 Current consumption (VDDIN33)(2) 2.8 mA
tSTART Start-up time(2) 10 ms
fOSC Operating frequency range 12 48 MHz
Duty Duty cycle(2) 40 60 %
CPARA Internal parasitic capacitance(2) Between XIN and XOUT 1 pF
Note:
  1. This oscillator is powered by the 2.5V regulated output of the VDDOUT25 regulator, which is supplied from VDDIN33.
  2. Simulation data

Three sets of crystal characteristics are supported with this oscillator corresponding to three operating frequency ranges:

  • Set 1: Crystal frequency is between 12 and 20 MHz. See Table 74-55.
  • Set 2: Crystal frequency is between 20 and 30 MHz. See Table 74-56.
  • Set 3: Crystal frequency is between 30 and 48 MHz. See Table 74-57.

When choosing a crystal, one and only one of these sets must be completely satisfied.

Table 74-55. Recommended Crystal Characteristics (Set 1)
Symbol Parameter Conditions Min Max Unit
f0 Fundamental frequency 12 20 MHz
CCRYSTAL Load capacitance 6 17.5 pF
CSHUNT Shunt capacitance 3 pF
ESR Equivalent series resistance 100 Ω
CM Motional capacitance 1.3 3.2 fF
PON Drive level 150 μW
Table 74-56. Recommended Crystal Characteristics (Set 2)
Symbol Parameter Conditions Min Max Unit
f0 Fundamental frequency 20 30 MHz
CCRYSTAL Load capacitance 6 12.5 pF
CSHUNT Shunt capacitance 3 pF
ESR Equivalent series resistance 100 Ω
CM Motional capacitance 1.3 3.2 fF
PON Drive level 300 μW
Table 74-57. Recommended Crystal Characteristics (Set 3)
Symbol Parameter Conditions Min Max Unit
f0 Fundamental frequency 30 48 MHz
CCRYSTAL Load capacitance 6 10 pF
CSHUNT Shunt capacitance With ESRMAX = 60Ω 3 pF
With ESRMAX = 80Ω 1 pF
ESR Equivalent series resistance With CSHUNT_MAX = 1 pF 80 Ω
With CSHUNT_MAX = 3 pF 60 Ω
CM Motional capacitance 1.3 3.2 fF
PON Drive level 400 μW
Figure 74-45. Main Crystal Oscillator

CLEXT = 2 x (CCRYSTAL – CPARA – CPCB / 2).

where CPCB is the single-ended (ground referenced) parasitic capacitance of the printed circuit board (PCB) on XIN and XOUT tracks. For example, if the crystal is specified for a 12.5 pF load, with CPCB=1 pF (on XIN and on XOUT), CLEXT = 2 x (12.5 - 1 - 0.5) = 22 pF.