1.1.8 Reliability

The following list describes the reliabilities:

  • Single Event Upset (SEU)-Immune
    • Zero FIT FPGA configuration cells
  • Junction temperature
    • 125 °C—Military Temperature
    • 100 °C—Industrial Temperature
    • 85 °C—Commercial Temperature
  • SECDED protection on the following
    • Embedded memories (eSRAMs)
    • PCIe buffer
    • DDR memory controllers with optional SECDED modes
  • Buffers implemented with SEU resistant latches on the following
    • DDR bridges (HPMS, MDDR, and FDDR)
    • SPIFIFO
    • NVM integrity check at power-up and on-demand
    • No external configuration memory required—instant-on, retains configuration when turned off