39.3.6 Thermal Characteristics

Table 39-6. 
Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +125°C
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 70.0 °C/W 14-pin PDIP package
95.3 °C/W 14-pin SOIC package
100.0 °C/W 14-pin TSSOP package
51.5 °C/W 16-pin UQFN 4x4mm package
62.2 °C/W 20-pin PDIP package
87.3 °C/W 20-pin SSOP package
77.7 °C/W 20-pin SOIC package
43.0 °C/W 20-pin UQFN 4x4mm package
TH02 θJC Thermal Resistance Junction to Case 32.75 °C/W 14-pin PDIP package
31.0 °C/W 14-pin SOIC package
24.4 °C/W 14-pin TSSOP package
5.4 °C/W 16-pin UQFN 4x4mm package
27.5 °C/W 20-pin PDIP package
31.1 °C/W 20-pin SSOP package
23.1 °C/W 20-pin SOIC package
5.3 °C/W 20-pin UQFN 4x4mm package
TH03 TJMAX Maximum Junction Temperature 150 °C
TH04 PD Power Dissipation — W PD=PINTERNAL+PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL=IDDxVDD(1)
TH06 PI/O I/O Power Dissipation — W PI/O=Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
TH07 PDER Derated Power — W PDER=PDMAX (TJ-TA)/θJA(2)
Note:
  1. IDD is current to run the chip alone without driving any load on the output pins.
  2. TA = Ambient Temperature, TJ = Junction Temperature.