39.3.6 Thermal Characteristics

Table 39-6.
Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	55	°C/W	28-pin SPDIP package
			74	°C/W	28-pin SOIC package
			67.1	°C/W	28-pin SSOP package
			—	°C/W	28-pin VQFN 4x4 mm package
TH02	θ_JC	Thermal Resistance Junction to Case	36	°C/W	28-pin SPDIP package
			19	°C/W	28-pin SOIC package
			23.9	°C/W	28-pin SSOP package
			—	°C/W	28-pin VQFN 4x4 mm package
TH03	T_JMAX	Maximum Junction Temperature	—	°C	T_JMAX = T_AMAX + (PD_MAX x θ_JA)⁽²⁾
TH04	PD	Power Dissipation	—	W	PD = P_INTERNAL+P_I/O
TH05	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL = I_DDxV_DD⁽¹⁾
TH06	P_I/O	I/O Power Dissipation	—	W	P_I/O=Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH07	P_DER	Derated Power	—	W	P_DER = PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature.