8.3.7 Thermal Specifications

Table 8-10. Thermal Specifications
SymbolDescriptionTyp. UnitConditions
θJAThermal Resistance Junction to Ambient75°C/W20-pin SSOP package (SS)
53°C/W20-pin VQFN package (REB)
TJMAXMaximum Junction Temperature

Refer to the Absolute Maximum Ratings

section.
Note:
  • Power dissipation is calculated as follows: PDIS = VDD × {IDD - Σ IOH} + Σ {(VDD - VOH) × IOH} + Σ (VOI × IOL).
  • Internal Power Dissipation is calculated as follows: PINTERNAL = IDD × VDD, where IDD is the current required to run the chip alone, without driving any load on the output pins.
  • Derated Power is calculated as follows: PDER = PDMAX (TJ-TA)/θJA, where TA is the ambient temperature and TJ is the junction temperature.