9.2.3 68-Lead Very Thin Plastic Quad Flat, No Lead Package (VZ) - 8x8x0.9 mm Body (VQFN)

The following figure illustrates the footprint dimensions of the IS2064S SoC.

Note:

1. Dimensioning and tolerance per ASME Y14.5M
   • BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias if used, must be filled or tended to avoid solder loss during reflow process.
3. For the most current package drawings, see the Microchip Packaging Specifications located at http://www.microchip.com/packaging.