9.2.1 56-Lead Land Grid Array (VZ) - 7x7x1 mm Body (LGA)

The following figure illustrates the footprint dimensions of the IS2062GM SoC.

Note:

1. Dimensioning and tolerance per ASME Y14.5M
   • BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias if used, must be filled or tended to avoid solder loss during reflow process.
3. For the most current package drawings, see the Microchip Packaging Specification located at http://www.microchip.com/packaging.