51.2 CPU Electrical Characteristics

Table 51-3. Operating Frequency Versus Voltage
Param. No. VDDIOx, AVDD, VDDREG Range Temp. Range (in °C) Max CPU Frequency Comments
DC_5 1.71V to 3.63V -40°C to +85°C FCLK_1 MHz Industrial
Table 51-4. CPU Thermal Operating Conditions
Rating Symbol Min. Typ. Max. Unit
Industrial Temperature Devices

Operating Ambient Temperature Range

Operating Junction Temperature Range

 TA

TJ

 -40

—

 — 85

105

 °C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIOx x (IDD –∑ IOHVDDIOx)) + (VUSB3V3 x IDDUSB) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG)

I/O Pin Power Dissipation:

PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)

 PD PINT + PI/O W
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
Table 51-5. Thermal Packaging Characteristics (1)
Characteristics Symbol Typ. Max. Unit
Thermal Resistance, 144-pin TQFP (16x16x1 mm) Package θJA 17.1 — °C/W
Thermal Resistance, 100-pin eTQFP (14x14x1 mm) Package θJA 18.5 — °C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package θJA 21.3 — °C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.