48.21 Serial Peripheral Interface (SPI) Electrical Specifications

Figure 48-11. SPIx Host Module CPHA = 0 Timing Diagrams
Figure 48-12. SPIx Host Module CPHA = 1 Timing Diagrams
Table 48-30. SPIx Module Host Mode Electrical Specifications (1)
AC CHARACTERISTICSStandard Operating Conditions: VDDIO = AVDD 1.75V to 3.63V, VDDREG = 1.75V to 1.85V(unless otherwise stated)

Operating temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristics(1)Min.TypicalMax.UnitsConditions
MSP_1FSCKSCK FrequencyNormal Speed SERCOM——23MHzFull Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 1.8V,

CLOAD = 30 pF(MAX)

——35Full Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 3.3V,

CLOAD = 30 pF(MAX)

——1/(2*(TMIS+NOTE2_TV)) (2)Full Duplex Transmit and Receive mode,

CLOAD = 30 pF(MAX).

The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than those listed above may therefore be possible using the formula.

High-Speed SERCOM (3)——30MHzFull Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 1.8V,

CLOAD = 20 pF(MAX)

——50Full Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 3.3V,

CLOAD = 20 pF(MAX)

——1/(2*(TMIS+NOTE2_TV)) (2)Full Duplex Transmit and Receive mode,

CLOAD = 20 pF(MAX).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than those listed above may therefore be possible using the formula.

MSP_3TSCLSCK Output Low Time1/(2*FSCK)——ns—
MSP_5TSCHSCK Output High Time1/(2*FSCK)——ns—
MSP_7TSCFSCK and MOSI Output Fall Time——DI_27nsSee parameter DI_27 I/O spec
MSP_9TSCRSCK and MOSI Output Rise Time——DI_25nsSee parameter DI_25 I/O spec
MSP_11TMOVMOSI Data Output Valid after SCKNormal Speed SERCOM——9ns—
High Speed SERCOM (3)——8ns
MSP_13TMOHMOSI hold after SCK0——ns
MSP_15TMISMISO Setup Time of Data Input to SCKNormal Speed SERCOM13——ns
High Speed SERCOM (3)1.5——ns
MSP_17TMIHMISO Hold Time of Data Input to SCKNormal Speed SERCOM4——ns
High Speed SERCOM (3)2 —ns
MSP_19SPI_GCLKSERCOM SPI input clk freq, GCLK_SPI——FCLK_23MHz—
Note:
  1. Assumes for Normal Speed SERCOM: VDDIO(min) and 30 pF external load on all SPIx pins, and for High Speed SERCOM: VDDIO = 3.3V and 20 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TV is the client external device data output valid time from clock edge specification.
  3. High Speed SERCOM = SERCOM4, SERCOM6, SERCOM7, SERCOM8.
Figure 48-13. SPIx Client Mode CPHA = 0 Timing Diagrams
Figure 48-14. SPIx Client Mode CPHA = 1 Timing Diagrams
Table 48-31. SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS Standard Operating Conditions: VDDIO = AVDD 1.75V to 3.63V, VDDREG = 1.75V to 1.85V (unless otherwise stated)

Operating temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristics(1)Min.TypicalMax.UnitsConditions
SSP_1FSCKSCK FrequencyNormal Speed SERCOM——23MHzFull Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 1.8V,

CLOAD = 30 pF()max

——35Full Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 3.3V,

CLOAD = 30 pF(max)

——1/(2*(TSOV+NOTE2_TMIS)) (2)Full Duplex Transmit and Receive mode,

CLOAD= 30 pF(max).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than those listed above may therefore be possible using the formula.

High Speed SERCOM (3)——30MHzFull Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 1.8V,

CLOAD = 20 pF(max)

——50Full Duplex Transmit and Receive mode,

SPI FIFO enabled,

DMA enabled.

VDDIOx = 3.3V,

CLOAD = 20 pF(MAX)

——1/(2*(TSOV+NOTE2_TMIS)) (2)Full Duplex Transmit and Receive mode,

CLOAD= 20 pF(max).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than those listed above may therefore be possible using the formula.

SSP_3TSCLSCK Output Low Time1/(2*FSCK)——ns—
SSP_5TSCHSCK Output High Time1/(2*FSCK)——ns—
SSP_7TSCFSCK and MOSI Output Fall Time——DI_27nsSee parameter DI_27 I/O spec
SSP_9TSCRSCK and MOSI Output Rise Time——DI_25nsSee parameter DI_25 I/O spec
SSP_11TSOVMOSI Data Output Valid after SCKNormal Speed SERCOM——23.2ns—
High Speed SERCOM (3)——8.5ns
SSP_13TSOHMOSI hold after SCKNormal Speed SERCOM18.4——ns
High Speed SERCOM (3)7.5——ns
SSP_15TSISMOSI Setup Time of Data Input to SCKNormal Speed SERCOM4.8——ns
High Speed SERCOM (3)3.7——ns
SSP_17TSIHMOSI Hold Time of Data Input to SCKNormal Speed SERCOM2.8——ns
High Speed SERCOM (3)2.8——ns
SSP_19TSSSSS setup to SCKNormal Speed SERCOM4.8——ns
High Speed SERCOM (3)3——ns
SSP_21TSSHSS hold after SCK ClientNormal Speed SERCOM2.9——ns
High Speed SERCOM (3)2.9——ns
SSP_23SPI_GCLKSERCOM SPI input clk freq, GCLK_SPI———FCLK_23MHz—
Note:
  1. Assumes for Normal Speed SERCOM: VDDIO(min) and 30 pF external load on all SPIx pins, and for High Speed SERCOM: VDDIO = 3.3V and 20 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TMIS is the host external device setup time.
  3. High Speed SERCOM = SERCOM4, SERCOM6, SERCOM7, SERCOM8.