58 Revision History

Revision H - March 2026

SectionDescription
General
  • Updated all references of AXI to AHB throughout the document
Up to 2 MB Live-Update Flash and 512 KB SRAM with Hardware Security Module (HSM) for Secure Connectivity Applications
  • Updated Temperature in Operating Conditions
Package and Pinout
  • Updated the 48-pin Table
Signal Description
  • Updated all tables in this section to include new specs for the 48-pin VQFN
Power Supplies and Startup Considerations
  • Updated VDDUSB to VUSB3V3 in the following sections:
    • Power Domain Overview
    • Power Supplies
    • Power-on Reset (POR) and Brown-out Reset (BOR)
Memories
  • Added a note to FUCFG9 and redefined it
Hardware Security Module (HSM)
  • Updated the RAM specifications in Features.
Device Service Unit (DSU)
  • Updated the CPUx bitfield description in the DAL Register
Main Clock (MCLK)
  • Removed erroneous text from Main Clock
  • Removed the Clock Domains section
  • Removed erroneous information from Principle of Operation
  • Removed the Selection the Synchronous Clock Division Ratio section
  • Clarified verbiage in Clock Ready Flag
  • Clarified verbiage in Interrupts
  • Removed an erroneous Register, Clock Divide n Register
  • Redefined bitfields in the following registers:
    • CLKMSK0
    • CLKMSK1
    • CLKMSK2
    • CLKMSK3
Direct Memory access Controller (DMAC)
  • Added a note to Arbitration for PORT Resources
  • Removed the Event System Priority Increase section
  • Updated the CTRLB Register with new bitfield numbering and notes
  • Updated the CHCTRLBk Register with a new note on the BYTORD bitfield and redid the table for the PR bitfield
  • Updated the CHEVCTRLk register with table updates to the EVAUXACT bitfield
  • Updated the CHCTRLCRCk with new verbiage for the CRCROUT and CRCXOR bitfields
Power Manager (PM)
  • Added a new note to the RAMCFG bitfield in the STDBYCFG and HIBCFG Registers
External Interrupt Controller (EIC)
  • Added a note to External Pin Processing
Ethernet Media Access Controller (ETH)
  • Added a note to Partial Store and Forward Using Packet Buffer DMA
Event System (EVSYS)
  • Added a note to Sleep Mode Operation
  • Updated the USERm Register to display eight bits, and revised part of the Event User Mapping table
I/O Pin Controller (PORT)
  • Added a note to Events
Universal Serial Bus Hi-Speed (USBHS)
  • The following registers were restructured with renumbered bitfields:
    • INTRTX
    • INTRRX
    • INTRTXE
    • INTRRXE
    • CSR0L
SD/MMC Host Controller (SDHC)
  • Updated the following registers, removed erroneous bits or added new verbiage:
    • HC1R
    • NISTR
    • EISTR
    • EISTER
    • EISIER
    • CA0R
    • CA1R
    • ACR
Configurable Custom Logic (CCL)
  • Updated the INSELy bitfield in the LUTCTRLn Register with new data in the bitfield table
Analog-to-Digital Converter (ADC)
  • Updated the ADCHSEL bitfield table in the CTRLB Register to reflect new values for the ADC module
Timer/Counter for Control Applications (TCC)
  • Updated the following registers with new bitfield definitions:
    • EVCTRL
    • INTENCLR
    • INTENSET
    • INTFLAG
    • WAVE
Electrical Characteristics 85°C
  • Updated Min, Typ, and Max specifications in the tables for the following sections:
    • Power Supply
    • MCU Active Power
    • MCU Idle Power
    • MCU Standby Power
Electrical Characteristics 125°C
  • Added the following new sections:
    • MCU Active Power
    • MCU Idle Power
    • MCU Standby Power

Revision G - June 2025

SectionDescription
Up to 2 MB Live-Update Flash and 512 KB SRAM with Hardware Security Module (HSM) for Secure Connectivity Applications
  • Added in new temperature range for Operating Conditions
Package and Pinout
Signal Description
  • Replaced the Serial Communication Interface (SERCOM) Signals table with a new table
Multi-Channel RAM Controller (MCRAMC)
  • All new updated chapter
Clock Distribution System
  • Added a new note to Overview for asynchronicity
PORT
  • Added the following Registers:
    • INTENCLR
    • INTENSET
    • INTFLAG
    • NONSEC
    • NSCHK
WDT
  • Updated the EWOFFSET bitfield of the EWCTRL Register with a new signal name, replacing GCLK_WDT with CLK_WDT_OSC
DMAC
  • Updated the Register output for all Channel k Registers to properly display in the Register Summary
ETH
SERCOM USART
SERCOM I2C
TCC
Electrical Characteristics 85°C
Electrical Characteristics 125°C
  • All new Electrical Specifications chapter

Revision F - December 2024

SectionDescription
Up to 2 MB Live-Update Flash and 512 KB SRAM with Hardware Security Module (HSM) for Secure Connectivity Applications
  • Removed erroneous 512K references
Pinout
  • Updated the table titles in 64-Pin TQFP Packages to correct the family name
  • Updated the table titles in 100-Pin TQFP Packages to correct the family name and updated erroneous VSS references to new Pad names
Product Mapping
Memories

Revision E - October 2024

SectionDescription
Configuration Summary
  • Added new tables to reflect new package offerings
Package and Pinout
Signal Descriptions
  • Updated all tables to display new pin counts for the 48-pin TQFP and 144-pin TFBGA
Power Supplies and Startup Considerations
Memories
SUPC
  • Added a note to Overview
  • Updated the Block Diagram with new signal names
RSTC
  • Updated the BORVDDA bitfield of the RCAUSE Register with a new note
PORT
  • Added a new table to the PMUXm Register
TCC
CCL
ADC
  • Updated the input Signal names from AIN to VINP throughout the chapter
Electrical Characteristics (85°C)
Packaging

Revision D - July 2024

SectionDescription
Package and Pinout
Signal Description
  • Updated Table 6-13 PORTA through PORTD Signals with a new pin number for PB00
Clock Distribution System
TrustRAM (TRAM)
Electrical Characteristics (85°C)

Revision C - April 2024

SectionDescription
GeneralMinor changes of format.
  • VREFP0 changed by VREFH
  • SPIxC- TRL changed by SPIxCTRL
  • VDDF changed by VDDFLASH
  • ADC0 changed by ADC
  • ADCn changed by ADC
  • INSELx changed by INSELy
  • Remove VBAT references
Features
  • Updated info of USB2.0 and Advanced Analog Features and Touch. Removed NIST compliant information.
Configuration Summary
Guidelines for Getting Started
  • Replaced Pie-Filters by Pi-Filters in the EMI/EMC/EFT (IEC61000-4-4 and IEC 61000-4-2) Suppression Considerations section
Package and Pinout
Signal Description
  • Added info of 64-Pin and 100-Pin in all the tables
Power Supplies and Startup Considerations
Product Mapping
Peripherals
Processor and Architecture
Memories
Cortex-M Cache Controller (CMCC)
Peripheral Access Controller (PAC)
Device Service Unit (DSU)
Clock Distribution System
Oscillator Controller (OSCCTRL)
Generic Clock Controller (GCLK)
Main Clock (MCLK)
  • Updated Synchronous Clock Selection
32 KHz Oscillators Controller (OSC32KCTRL)
Frequency Meter (FREQM)
  • Minor changes of format in Overview and Measurement sections
  • Added notes in SWRST bitfield in the CTRLA Register
  • Added note in REFNUM bitfield in the CFGA Register
Real-Time Counter (RTC)
Direct Memory Access Controller (DMAC)
  • Updated channels of DMA Controller modules 0 and 1
  • Updated DMA Event/Trigger Mapping
Supply Controller (SUPC)
Power Manager (PM)
Reset Controller (RSTC)
  • Removed VBAT reference in Features and the Reset Causes and Effects sections
External Interrupt Controller (EIC)
Event System (EVSYS)
Serial Communication Interface (SERCOM)
Serial Quad Interface (SQI)
  • Updated Chip Selects to 4
  • Updated Figure 36-1
  • Updated CSEN bitfield in CFG Register
Universal Serial Bus Hi-Speed (USBHS)
Controller Area Network (CAN)
True Random Number Generator (TRNG)
  • Updated second paragraph in Overview section
  • Removed one bullet in Features section
Configurable Custom Logic (CCL)
Analog-to-Digital Converter (ADC)
Analog Comparators (AC)
  • Updated MUXPOS bitfield in COMPCTRL0 Register
Position Decoder (PDEC)
Timer/Counter for Control Applications (TCC)
TrustRAM (TRAM)
  • Added note 4 in CTRLA Register
  • Added note 2 in CTRLA Register
Peripheral Touch Controller (PTC)
  • Minor changes in Clocks section
Electrical Characteristics (85°C)
  • Updated Note 4

Revision B - May 2023

SectionDescription
General
  • Updated DPLL to read PLL throughout the document
Features
  • Updated Advanced Analog Features and Touch instances with new data for channel numbers
  • Reformatted the Communication Interfaces/Digital Peripherals section
  • Updated the DMA instances
Configuration Summary
  • Replaced the existing tables with all new content
Signal Description
  • Replaced the existing tables with all new content
Block Diagram
  • Updated the Diagram with a new image
Pinout
Power Supplies and Startup Considerations
Processor and Architecture
Memories
CMCC
  • Updated the WAYNUM bitfield in the TYPE Register with a new table
IDAU
  • This chapter was completely rewritten in this revision
DSU
  • Corrected erroneous bitfield output for the CPUx bitfield in the DAL Register
  • Removed an obsolete DATA Register Summary and associated Register
Clock Distribution System
OSCCTRL
GCLK
  • Updated Figure 19-3 in Generic Clock Generator, changed DPLL to PLL and removed erroneous clock signals
  • Corrected erroneous bitfield output in the following registers, and/or updated bitfield descriptions:
    • SYNCBUSY
    • GENCTRLn
    • PCHCTRLm
MCLK
  • Added a new register, CLKDIV
OSC32KCTRL
  • Updated the CGM and STARTUP bitfields to properly display content in the XOSC32K Register
WDT
  • Updated the following registers to properly display bitfield information:
RTC
  • Updated the TAMPCTRL Register to properly display the INnACT bitfield output
SUPC
  • Removed erroneous LDO information from the Block Diagram
  • Removed erroneous bitfields for ULDOOVHEAT, and ULDORDY from the following registers:
  • Removed erroneous bitfields for BKUP_VLD, SRAM_VLD, ULDOLEVEL, ULDSTDBY, ULDOEN, and OFFSTDBY from the VREGCTRL Register
  • Added new information for the LVSTDBY and VREGOUT bitfields in the VREGCTRL Register
RSTC
NVMCTRL
ADC
Electrical Specifications 85°C
Extended Temperature Electrical Characterstics (125°C)
  • All new section
Schematic Checklist
  • Updated the voltage specifications in the Diagram in Introduction
Packaging

Revision A - November 2022

Terminology used in this document may not match with the contents of other Microchip documentation and collateral. For any questions or concerns regarding terminology, contact a Microchip support or sales representative.

This is the initial released version of this document.