40.2 General Operating Ratings and Thermal Conditions

Table 40-2. Operating Frequency Vs. Voltage
Param. No.	VDDIO, VDDIN, AVDD Range	Temp. Range (in °C)	Max MCU Frequency	Comments
DC_7	2.7 to 5.5V⁽¹⁾	-40°C to +125°C	48 MHz	Extended
Note: With BODVDD disabled. If BODVDD is enabled, refer to the REG_47 parameter.

Table 40-3. MCU Thermal Operating Conditions
Rating	Symbol	Min.	Typ.	Max.	Unit
Extended Temperature Range Operating Ambient Temperature Range Operating Junction Temperature Range	TA TJ	-40 —	—	125 145	°C °C
Power Dissipation: Internal Chip Power Dissipation: PINT = (VDD x (IDD –∑ IOHV_DD)) + (VDDIO x (IDD –∑ IOH_VDDIO)) I/O Pin Power Dissipation: ∑ ((VDD – VOH) x IOHVDD) + ∑ (VOL X IOLV_DD) + ∑ ((VDDIO – VOH) x IOH_VDDIO) + ∑ (VOL x IOL_VDDIO)	PD	PINT + PI/O			W
Maximum Allowed Power Dissipation	PDMAX	(TJ – TA)/θJA			W

Table 40-4. Thermal Packaging Characteristics⁽¹⁾
Characteristics	Symbol	Typ.	Max.	Unit
Thermal Resistance, 32-pin TQFP (7x7x1 mm) Package	θJA	63.1	—	°C/W
Thermal Resistance, 48-pin TQFP (7x7x1 mm) Package	θJA	62.7	—	°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package	θJA	56.3	—	°C/W
Thermal Resistance, 32-pin VQFN (5x5x1 mm) Package	θJA	40.9	—	°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package	θJA	30.9	—	°C/W
Thermal Resistance, 64-pin VQFN (9x9x1 mm) Package	θJA	31.4	—	°C/W
Note: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.